Tachyum expands Prodigy’s value with licensable TPU core for AI in IoT, edge devices

Tachyum announced that it is expanding Tachyum Prodigy value proposition by offering its Tachyum TPU (Tachyum Processing Unit) intellectual property as a licensable core. This will enable developers to utilise intelligent AI (artificial intelligence) in IoT (internet of things) and edge devices that are trained in datacentres. Tachyum’s Prodigy is a universal processor combining general purpose

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Elliptic Labs secures PoC contract with global OEM to enhance user experience

Elliptic Labs, has announced a PoC (proof of concept) contract with a global OEM (original equipment manufacturer) leveraging its AI (artificial intelligence) virtual smart sensor platform delivering user experiences enabling cohesive interactions across the product lineup. The AI technologies, including ultrasound and sensor fusion skills, combined with an understanding of the smartphone, PC (personal computer),

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SUSE advances capabilities to its software stack to help customers accelerate digital transformation

SUSE, a global provider of secure enterprise-grade open source solutions at SUSECON announced new advanced capabilities to help customers accelerate digital transformation as a part of its mission to best secure IT infrastructure and accelerate digital trust.

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5G multi-mode chipset and 5G CPE Pro launched by Huawei

Huawei has launched its 5G multi-mode chipset Balong 5000 – along with the first commercial 5G device powered by it, the Huawei 5G CPE Pro.

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AT&T Smart Cities Strategic Alliance joined by Synchronoss to help transform cities around the world

Synchronoss Technologies, Inc., a global provider of cloud, messaging, digital, and IoT products,  has joined the AT&T Smart Cities Strategic Alliance to help transform cities around the world. Its digital and IoT product portfolio and expertise will be leveraged by some of the mobile industry’s biggest names

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Riot starts with a claim to industry’s lowest power NB-IoT and eMTC baseband chip

Internet of Things (IoT) newcomer, Riot Micro is claiming that a radical design approach applying BLE/Wi-Fi architecture has delivered a new cellular IoT solution with cost/power levels that are characteristic of short-range wireless systems. Here Peter Wong, CEO, tells  Jeremy Cowan how Riot has reinvented itself as an IoT chipset maker.

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AT&T approves Altair’s integrated LTE-M chipsets to power new class of IoT modules and devices

Altair Semiconductor, a provider of LTE chipsets, reports that the ALT1210 LTE-M chipset has successfully completed AT&T’s ADAPT chipset validation process. The ADAPT validation improves time-to-market and reduces the cost associated with the introduction of new Internet of Things (IoT) devices.

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A Week in IoT: Broadcom mulls $100bn bid for Qualcomm, as Ayla banks $60m Chinese backing

Broadcom Ltd. is rumoured to be considering a bid of up to US$100 billion for Qualcomm Inc., according to a report by Bloomberg. As Jeremy Cowan writes, if it goes ahead this could be one of the biggest ever acquisitions of a chipmaker.

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HomeGrid Forum’s Donna Yasay steps down as president of industry alliance promoting G.hn

HomeGrid Forum has announced that Donna Yasay will be stepping down as president following a successful two years with the Forum. Under Donna’s leadership, the HomeGrid Forum says it has flourished in the networking and communications market, ensuring G.hn products are multi-vendor interoperable even with multi-vendor silicon.

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u-blox ‘amicably terminates’ contract to buy SIMCom’s cellular product line

u-blox, a global provider in wireless and positioning modules and chips, and SIM Technology Group Limited announced that they will not proceed with the sale, respectively acquisition, of SIMCom cellular module product line.

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Greenwave Systems claims a first in voice-activated smart gateway solutions for service providers

Greenwave Systems’ new AXON Platform® for Conversational IoT is a carrier-grade smart gateway that supports a hands-free, voice-activated speaker with a customisable wake-up word and open architecture.

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Two new Qualcomm-based modules expand Telit's 3G HSPA and HSPA+ offerings

Raleigh, North Carolina, USA. (BUSINESS WIRE) –Telit Wireless Solutions, a global vendor of M2M modules and value-added services, has introduced the UE910 V2 HSDPA and HE910 V2 HSPA+ modules based on Qualcomm Technologies, Inc. chipsets

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