GCT Semiconductor LTE Single-Chip now certified for LTE modules on Verizon Wireless network
San Jose, California, USA. (BUSINESS WIRE) — GCT Semiconductor, a designer and supplier of 4G mobile semiconductors, has announced that its LTE single-chip, GDM7240, has been certified for use in 4G LTE modules on the Verizon 4G LTE wireless network. Device makers seeking an LTE module can now benefit from faster time-to-market.
The certification means that original equipment manufacturers (OEMs) can embed GDM7240 in a 4G LTE module, for use in a variety of devices for consumer electronics, automotive applications, M2M, and smart meters, and take advantage of Verizon Wireless’ high-speed service. The use of a certified single-chip will enable 4G LTE device OEMs to accelerate time-to-market for their products.
GDM7240 is already embedded in a Verizon-certified 4G LTE module, from a leading module maker, that includes functionalities such as OTA-DM and IMS client.
Verizon reportedly operates the world’s largest 4G LTE wireless network, available today in 337 US markets, reaching nearly 75% of the US population.
“With Verizon’s certification, device makers seeking an LTE module can now benefit from fast time-to-market,” said Dr. Kyeongho (KH) Lee, president and CEO of GCT. “By using our high-performing and proven GDM7240 with a LTE module, device makers can launch products with LTE connectivity faster, easier and most cost-effectively. We look forward to working closely with Verizon to enable more devices to connect to Verizon’s 4G LTE network.”
GCT Semiconductor is a fabless designer and supplier of advanced 4G mobile solutions. GCT’s products are system-on-a-chip solutions that integrate radio frequency, baseband modem and digital signal processing functions onto a single die for the 4G LTE and WiMAX markets. GCT was the first to commercialise single-chip solutions for LTE and WiMAX. GCT’s proprietary technology and system-level expertise enable it to provide complete 4G platform solutions, which are said to be differentiated by their small form factors, low power consumption, high performance, high reliability and cost effectiveness.