NextG-Com becomes 1000th member of the Weightless SIG community

Weightless_SIG_1000_Members

(Cambridge & Staines, UK) — The Weightless SIG (Special Interest Group) has announced that NextG-Com, protocol stack and wireless embedded system component developer, has joined its ranks as its one thousandth member.

NextG-Com joined the SIG earlier this year as an Associate Member as a first step in understanding the opportunity for Weightless technology. Since then the company has been developing a series of machine-to-machine (M2M) terminal protocol stack solutions and related components.

NextG-Com, which is headquartered in Staines Upon Thames, UK, has now migrated to Core Membership of the SIG. This will enable NextG-Com to take a more active and participative role in the working groups helping to define future developments of the standard.

Professor William Webb, CEO of the Weightless SIG, commented: “We are delighted to have reached this significant milestone in our membership so early in the evolution of the Weightless ecosystem,” adding that, “as we enter the next phase in our growth contributions from companies such as NextG-Com will be invaluable to our strategy.”

Weightless is enjoying growing support as a new wireless technology targeting M2M communications applications (See also: Complete spec for M2M communications over TV ‘white space’ announced by standards group.) Built on a cellular architecture, Weightless is the only data pipe of its kind that has been specifically optimised for global, long range, infrequent transmission of small data packets generated by M2M applications. Weightless is frequency agnostic and can use white space radio spectrum available within the gaps between TV transmissions.

Denis Bidinost, NextG-Com’s CEO, said: “Joining the Weightless SIG as a Core Member is a logical step for us. We have life-time experience of developing and testing embedded cellular software systems and components based on 3GPP standards. We see Weightless as the logical enabler for M2M application and service providers to deliver next generation solutions, and we look forward to contributing our effort as this technology is brought to market. As a company familiar with the challenges of working within the semiconductor and wireless industry, we expect our experience to further accelerate the technology.”

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