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Telink Semiconductor to demonstrate smart applications at Bluetooth Asia 2017 in Shenzhen
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Telink Semiconductor to demonstrate smart applications at Bluetooth Asia 2017 in Shenzhen

Posted by Zenobia HegdeSeptember 18, 2017

Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for Internet of Things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017 conference taking place in Shenzhen, China on 26-27 September 2017.

Bluetooth Asia 2017 will address a range of topics, from commercial and industrial to smart home solutions, with special emphasis on Bluetooth mesh networking and BLE 5.0. In particular, it will be a showcase of a multitude of IoT solutions enabled by Bluetooth. Telink Semiconductor offers chip solutions for a variety of low power wireless technologies including Bluetooth, BLE 5.0 and Bluetooth mesh.

At the conference, as a silver sponsor, Telink Semiconductor will show demos using its Bluetooth technology for:

    • Smart lighting – connected lighting, an integral part of the smart home
    • Smart home – a villa model, and an Apple HomeKit smart lock
    • Retail – groups of electronic shelf labels
    • Cold chain logistics – a wireless temperature sensor network
    • Many other applications such as remote control, toy, scale, cooling fan, etc.

For wireless smart lighting, the solution provided by Telink Semiconductor enables customers to easily implement features like on/off control, dimming and color space (luminance / saturation, RGB) control, grouping control, scene mode control, timer or sensor integration, control bridge, mesh networks and power consumption profiling.

In 2016, the company announced that its BLE SoC chip and mesh technology are being adopted in connected LED light bulbs from GE Lighting, in its C by GE product family.

Also, Telink Semiconductor will show a smart lock mechanism using the HomeKit module based on its BLE SoC, which enables password, fingerprint, key, card and manual operation. The combination of Bluetooth technology and Telink Semiconductor’s devices enable simple functions like locking and unlocking, but also many other features such as security assurance, battery level, charging status, battery warning, and archived log data.

The electronic shelf label is based on an E-ink screen that can display price, product name, bar code and promotions dynamically; the connectivity allows remote or centralised price and promotion changes synchronously, hence reducing maintenance and management effort.

The key features of the combination of Bluetooth technology and Telink Semiconductor’s additional functionality are that long distance data updates and secure data transfer with encryption are possible; in addition low power consumption enables longer service life, and Telink also enables OTA (over the air) firmware upgrades to be made.

In cold chain logistics, such as in the pharmaceutical and food industries, where food and medicines must be maintained at strictly controlled temperatures, Telink Semiconductor’s devices enable a wireless sensor network that can used in the field and supply chain for data collection and automatic control if required for corrective action.

The key features of the combination of Bluetooth and Telink Semiconductor’s solution are low power consumption, low data rates and low complexity. The demo at the conference will illustrate how information can be monitored and feedback collected by the temperature sensors at the nodes.

Telink offers a range of solutions for developers of low power connected devices and products for IoT applications. This includes a number of system-on-chip devices, software development kits, and reference designs.

For example, its TLSR8269 chip is the world’s first all-in-one system-on-chip for the Internet of Things, combining the radio frequency (RF), digital processing, protocols stack software and profiles for Bluetooth Low Energy, BLE Mesh, 6LoWPAN, Thread, ZigBee, RF4CE, HomeKit and 2.4GHz proprietary standard support in a single chip.

In addition, its integrated 512kB flash memory enables all functionality to be embedded in every chip, and the final end product functionality can then be configurable via software. This means it can even support over-the-air upgrades, product feature rollouts and upgrades.

Recently, the company released an SDK (software development kit) fully compatible with the new Bluetooth SIG mesh specification. In addition to meeting the standard specification, Telink’s devices have unique features – such as being able to update in real-time with complete and efficient presence information sharing on the network to reflect multiple nodes’ status automatically.

Telink Semiconductor will be exhibiting on booth number 20 at Bluetooth Asia 2017, taking place at the Shenzhen Convention & Exhibition Centre, Shenzhen, China, between 26-27 September 2017.

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