Telink Semiconductor to demonstrate smart applications at Bluetooth Asia 2017 in Shenzhen

Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for Internet of Things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017 conference taking place in Shenzhen, China on 26-27 September 2017.

Bluetooth Asia 2017 will address a range of topics, from commercial and industrial to smart home solutions, with special emphasis on Bluetooth mesh networking and BLE 5.0. In particular, it will be a showcase of a multitude of IoT solutions enabled by Bluetooth. Telink Semiconductor offers chip solutions for a variety of low power wireless technologies including Bluetooth, BLE 5.0 and Bluetooth mesh.

At the conference, as a silver sponsor, Telink Semiconductor will show demos using its Bluetooth technology for:

    • Smart lighting – connected lighting, an integral part of the smart home
    • Smart home – a villa model, and an Apple HomeKit smart lock
    • Retail – groups of electronic shelf labels
    • Cold chain logistics – a wireless temperature sensor network
    • Many other applications such as remote control, toy, scale, cooling fan, etc.

For wireless smart lighting, the solution provided by Telink Semiconductor enables customers to easily implement features like on/off control, dimming and color space (luminance / saturation, RGB) control, grouping control, scene mode control, timer or sensor integration, control bridge, mesh networks and power consumption profiling.

In 2016, the company announced that its BLE SoC chip and mesh technology are being adopted in connected LED light bulbs from GE Lighting, in its C by GE product family.

Also, Telink Semiconductor will show a smart lock mechanism using the HomeKit module based on its BLE SoC, which enables password, fingerprint, key, card and manual operation. The combination of Bluetooth technology and Telink Semiconductor’s devices enable simple functions like locking and unlocking, but also many other features such as security assurance, battery level, charging status, battery warning, and archived log data.

The electronic shelf label is based on an E-ink screen that can display price, product name, bar code and promotions dynamically; the connectivity allows remote or centralised price and promotion changes synchronously, hence reducing maintenance and management effort.

The key features of the combination of Bluetooth technology and Telink Semiconductor’s additional functionality are that long distance data updates and secure data transfer with encryption are possible; in addition low power consumption enables longer service life, and Telink also enables OTA (over the air) firmware upgrades to be made.

In cold chain logistics, such as in the pharmaceutical and food industries, where food and medicines must be maintained at strictly controlled temperatures, Telink Semiconductor’s devices enable a wireless sensor network that can used in the field and supply chain for data collection and automatic control if required for corrective action.

The key features of the combination of Bluetooth and Telink Semiconductor’s solution are low power consumption, low data rates and low complexity. The demo at the conference will illustrate how information can be monitored and feedback collected by the temperature sensors at the nodes.

Telink offers a range of solutions for developers of low power connected devices and products for IoT applications. This includes a number of system-on-chip devices, software development kits, and reference designs.

For example, its TLSR8269 chip is the world’s first all-in-one system-on-chip for the Internet of Things, combining the radio frequency (RF), digital processing, protocols stack software and profiles for Bluetooth Low Energy, BLE Mesh, 6LoWPAN, Thread, ZigBee, RF4CE, HomeKit and 2.4GHz proprietary standard support in a single chip.

In addition, its integrated 512kB flash memory enables all functionality to be embedded in every chip, and the final end product functionality can then be configurable via software. This means it can even support over-the-air upgrades, product feature rollouts and upgrades.

Recently, the company released an SDK (software development kit) fully compatible with the new Bluetooth SIG mesh specification. In addition to meeting the standard specification, Telink’s devices have unique features – such as being able to update in real-time with complete and efficient presence information sharing on the network to reflect multiple nodes’ status automatically.

Telink Semiconductor will be exhibiting on booth number 20 at Bluetooth Asia 2017, taking place at the Shenzhen Convention & Exhibition Centre, Shenzhen, China, between 26-27 September 2017.

Comment on this article below or via Twitter: @IoTNow OR @jcIoTnow


9 IoT applications that will change everything

Posted on: September 1, 2021

Whether you are a future-minded CEO, tech-driven CEO or IT leader, you’ve come across the term IoT before. It’s often used alongside superlatives regarding how it will revolutionize the way you work, play, and live. But is it just another buzzword, or is it the as-promised technological holy grail? The truth is that Internet of

Read more

Which IoT Platform 2021? IoT Now Enterprise Buyers’ Guide

Posted on: August 30, 2021

There are several different parts in a complete IoT solution, all of which must work together to get the result needed, write IoT Now Enterprise Buyers’ Guide – Which IoT Platform 2021? authors Robin Duke-Woolley, the CEO and Bill Ingle, a senior analyst, at Beecham Research. Figure 1 shows these parts and, although not all

Read more

CAT-M1 vs NB-IoT – examining the real differences

Posted on: June 21, 2021

As industry players look to provide the next generation of IoT connectivity, two different standards have emerged under release 13 of 3GPP – CAT-M1 and NB-IoT.

Read more

IoT and home automation: What does the future hold?

Posted on: June 10, 2020

Once a dream, iot home automation is slowly but steadily becoming a part of daily lives around the world. In fact, it is believed that the global market for smart home automation will reach $40 billion by 2020.

Read more

Bluetooth Range and Reliability: Myth vs Fact

Posted on: September 21, 2021

As Bluetooth is becoming more and more ubiquitous in smart homes, buildings, and factories, there are many myths about what the wireless technology can and cannot do. In fact, its capabilities go far beyond its use in consumer electronics and enables a wide range of professional solutions in commercial and industrial environments. Here are some of the common myths around Bluetooth – and the lesser-known facts

Read more

OQ Technology reveals patent portfolio in the US and Europe to improve satellite communications

Posted on: September 21, 2021

5G satellite operator OQ Technology has revealed six pending patent applications in the USA and in Europe that will improve satellite-based IoT and M2M communications in remote locations. OQ Technology’s patent applications include a “wake-up” technology for satellite IoT (Internet of things) devices, IoT device localisation, frequency and timing synchronisation, inter-satellite link technology and satellite

Read more