Mobiveil, Inc., a supplier of silicon intellectual property (SIP), platforms and IP-enabled design services, announced a partnership with Winbond. This partnership aims to deliver an IP (internet protocol) controller targeting automotive, smart IoT (Internet of Things), industrial, wearables, true wireless stereo (TWS), wireless headsets, smart speakers and connectivity applications.
Mobiveil adapted its HYPERRAM controller to leverage the characteristics of Winbond’s HYPERRAM device that offers speeds of up to 250MHz and densities from 32Mb to 512Mb supporting x8/x16 modes. SoC (system on a chip) designers are afforded high-performance and low-power gains with 10x higher density than eSRAM, achieve 10x lower power compared to standard DRAM and 2x lower power consumption compared to PSRAM with approximately 2x fewer pin count than PSRAM.
“Winbond is a leading global supplier of semiconductor memory solutions and an ideal partner,” remarks Ravi Thummarukudy, CEO of Mobiveil. “Our HYPERRAM IP controller will be a welcome device for designers in need of ultra-low power consumption because it extends standby for battery-operated applications. Its low pin count design will also be attractive for applications with space constraints.”
The HYPERRAM device from Winbond supports the HYPERBUS Interface for speeds of up to 500Mbps (x8 I/O) with 13 signal pins. The Mobiveil HYPERRAM controller provides support for an AXI memory mapped system interface, linear, hybrid and wrap burst and low power features such as deep power down and hybrid sleep mode. It also supports the AMBA 3 AHB-Lite system interface.
“Winbond’s HYPERRAM is designed to enrich the IoT experience among end users and provide a cost-effective ultra-low power memory solution to system designers,” adds Hsiang-Yun Fan, Winbond’s DRAM vice president. “Our HYPERRAM 3.0 with 22 pin count and an increased data transfer rate of 1000Mbps (x16 I/O) won the 7th China IoT Innovation Awards in 2022.”
Winbond has positioned itself as the market provider in HYPERRAM devices and provides a complete product line of high-quality memory solutions in the IoT and wearables market segments. Winbond continuously launches competitive products and provides customised memory solutions based on customers’ requirements and has shipped more than 400 million HYPERRAM devices from its inception.
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