Devices & Modules

floLIVE has announced that it is collaborating with Qualcomm Technologies, Inc. and its subsidiaries, one of the advanced wireless technologies providers. This will help to enhance global connectivity on the new Qualcomm Aware platform.

Kajeet, has unveiled Kajeet smartSIM, an eSIM solution designed to deliver intelligent IoT connectivity. Aligned with the GSMA specifications (SGP.32), Kajeet is to leverage remote SIM provisioning standards, all from within its Sentinel platform. Kajeet customers can expect a unified centre for control and network intelligence combined with the flexibility and optimal connectivity by multiple carrier networks,

Who controls your enterprise endpoints? It’s a simple question with a not-so-simple answer. Of course, if your company owns the device, common sense dictates that your company controls the device. But, Amazon’s recent erroneous banning of a device user throws this question into relief, especially as the Internet of Things (IoT) grows in value and

Semtech Corporation and Oxit have announced a collaboration to enable device manufacturers to build a single device with the OxTech Multi-Connectivity Module. This device is designed to connect to both AWS IoT (Amazon Web Services internet of things) Core for Amazon Sidewalk and AWS IoT Core for LoRaWAN (low power wide area networking) networks in the United States.

QuickLogic Corporation, a developer of embedded FPGA (field programmable gate arrays) (eFPGA) IP, ruggedised FPGAs and endpoint AI/ML (artificial intelligence / machine learning) solutions, and YorChip have formed a partnership to expand the world of FPGA chiplets. The collaboration will result in lineup of FPGA chiplets optimised for low power consumption and low cost, opening

UCLOUDLINK GROUP INC. has announced that the company has started to commercialise internet of things solutions, partnering with MAYA Net Solution Co., Ltd and NTT Media Supply Co., Ltd., a subsidiary of Japan’s Nippon Telegraph and Telephone Corporation (“NTT”). Building upon a cooperation since 2020, the cooperation has come to fruition with the new IoT (internet of things) solutions powered by

BrainChip Holdings Ltd, a commercial producer of ultra-low power, digital, event-based, neuromorphic AI (artificial intelligence) IP (internet protocol), announced that it has received its shipment of AKD1500 chips in silicon from GlobalFoundries. This will advance company’s IP into the next phase of development.

NEC Corporation of America (NEC), a provider and integrator of advanced IT, communications and networking solutions, has announced launch of new healthcare integrations within its UNIVERGE BLUE cloud services portfolio. These integrations connect the omni-channel UNIVERGE BLUE ENGAGE contact centre solution with electronic health record (EHR) systems, including Epic, ORACLE Cerner and MEDITECH. This advancement empowers healthcare providers to

WISeKey International Holding Ltd. has announced that its semiconductors and PKI (public key infrastructure) subsidiary, SEALSQ Corporation, is introducing VAULTIC292. This is a secure element tailored for IoT (internet of things) devices and sensors.

According to a new research report from IoT analyst firm Berg Insight, the global satellite IoT communications market is growing at a good steady pace. The global satellite IoT subscriber base grew to surpass 4.5 million in 2022. The number of satellite IoT subscribers will increase at a compound annual growth rate (CAGR) of 39.6%

Statista predicts that the number of IoT (internet of things) connected devices could skyrocket to over 75 billion by 2025. This means entrepreneurs, educators and learners will further enjoy increased connectivity and improved engagement as relevant information can be put to use more effectively, says Karoline Gore, freelance technology writer.

Teledyne FLIR, a part of Teledyne Technologies Incorporated, has announced release of its much-anticipated Lepton 3.1R, a radiometric thermal camera module with a 95-degree field of view (FOV), 160 x 120 resolution, and a scene dynamic range of up to 400 degrees celsius. The 3.1R model maintains the same compact and low-power form factor that

Innodisk announces release of the nanoSSD PCIe (peripheral component interconnect express) 4TE3 in response to increasing demands of edge AI (artificial intelligence) miniature design and high computing performance. The nanoSSD 4TE3 is a PCIe 4.0 x4 BGA SSD (solid state drives) featuring compact size, enhanced performance to unlock potential for 5G, automotive and aerospace applications.

The integration of internet of medical things devices in complex healthcare landscape represents a rallying cry for progress. With the ability to revolutionise patient care through enhanced diagnostics, real-time monitoring, streamlined operations and more, these ingenious gadgets and systems hold the promise of dramatically reshaping the healthcare industry. From hypervigilant smart monitors that oversee vital

Coral Sense has launched a module designed to cater to requirements of the smart building, construction, and industrial sectors. The ‘ABR-WM01-MLG wireless MCU module’ can be used by device makers or IT providers to perform complex control, monitoring, and wireless communication functions. Coral Sense’s ABR-WM01-MLG wireless MCU module employs Nordic nRF5340 SoC to deliver low

WINSYSTEMS has debuted entry in its well-received computer-on-module product line: the COMeT6-1100 COM (computer-on-module) express type 6 compact CPU (central processing unit) module. Leveraging the 11th gen Intel Core i3/i5/i7 processors for industrial, IoT (internet of things) and embedded systems, this module offers up to four cores of high-performance processing in a low-power platform. And, with RAM (random access