Connected Devices

CloudRAN.AI has made its official debut at the Mobile World Congress (MWC) 2024 in Barcelona. The firm specialises in providing pure software-driven Private 5G network solutions, tailored for vertical industries seeking to harness the power of edge cloud computing and AI to fuel their digital transformation.

With that, we come to the end of this riveting exploration into the evolution of the SIM card. From the format-one SIM cards that resembled credit cards, to the embedded and integrated SIM cards of our future, we have come a long way from the days when the whole device had to fit into your

Fibocom has announced the collaboration with STMicroelectronics in launching the  smart home solution using the Matter-compatible technologies, STM32WB55 and FG370. It ensures the centralised control of smart home devices across different protocols, allowing smart home devices to interact smoothly.

Fibocom launches a highly integrated multi-mode smart module SC208 with gigantic performance leaps in 4G category and a series of feature-packed multimedia experience improvements during MWC Barcelona 2024. Powered by the Snapdragon 460 mobile platform with an octa-core processor (4*A73 1.8GHz + 4*A53 1.6GHz) and with a high-performance graphics processing unit (GPU), the module is

Fibocom unveils the industry’s first 5G smart module solution that is compatible with Android, Linux and Windows operating systems, propelling the resilience of SoC-based wireless solution in the high-end AIoT market. The solution is developed to adapt the diverse programming languages in the application layer and open convenience for software engineers in the field of

Fibocom has unveiled a deployable and commercialised 5G RedCap module solution tailored for 5G IoT scenarios. This initiative has been launched in collaboration with key customers, including but not limited to Askey, Quanta Computer and PLANET.

Remote SIM Provisioning (RSP) stands as a transformative development in telecommunications, reshaping how devices connect to and interact with mobile networks. This technology builds upon the advancements of traditional SIM, eSIM and eUICC technologies, offering an innovative approach to managing mobile network subscriptions. RSP enables users and devices to connect to any network provider remotely,

Fibocom has unveiled the 5G smart module solution that is compatible with Android, Linux and Windows operating systems, propelling the resilience of SoC-based wireless solution in the high-end AIoT market. The solution is developed to adapt the diverse programming languages in the application layer and open convenience for software engineers in the field of industrial

Integrated SIM (iSIM) technology emerges as the latest advancement in the realm of telecommunications, pushing the boundaries of integrated connectivity further than ever before. Building on the foundation laid by its predecessors, including the traditional SIM, eSIM, and eUICC technologies, iSIM represents a significant leap towards more efficient, secure, and streamlined mobile and IoT device

Fibocom, a leading global provider of IoT (Internet of Things) wireless solutions and wireless communication modules, exhibited at Mobile World Congress Barcelona at Booth #5I33 in Hall 5 of Fira Gran Via. Committed to accelerating connectivity for an intelligent future, Fibocom showcased its state-of-the-art wireless modules and solutions, incorporating cutting-edge technologies like RedCap and AI,

Embedded universal integrated circuit card (eUICC) technology represents a significant leap forward in the evolution of SIM card capabilities, setting a new standard for flexibility, efficiency and global connectivity. As an advanced form of embedded SIM (eSIM), eUICC technology offers the dynamic ability to manage multiple network profiles and switch between them remotely, without the

pSemi Corporation has announced the PE44951, a low-power, two-way phase shifter with digitally controlled step attenuation (DSA) for applications within the 5.925 – 7.525 GHz range. pSemi will showcase its latest products ideal for IoT connectivity, including the recently announced PE562212 front end module (FEM) and the PE423211 SPDT switch, an automotive UWB solution, at Mobile World Congress (MWC) 2024, taking place

The evolution of SIM card technology reached a significant milestone with the introduction of the embedded SIM, or eSIM. This innovative technology represents a paradigm shift in mobile connectivity, moving away from the physical SIM cards to a fully integrated solution. eSIMs mark the beginning of a new era in telecommunications, offering unprecedented flexibility, improved

Iveda has introduced IvedaAI Sense, an AI-based sensor that can detect smoke and vapor particles and incidents of bullying. Integrated into the IvedaAI platform, IvedaAI Sense can be installed in various settings, including schools, offices and other public spaces. IvedaAI uses deep learning technology to constantly observe everyday behaviours and patterns, continually improving its analytics

With the continuous race for slimmer and more sophisticated smartphones, in the early 2010s Apple unveiled the Nano-SIM or 4FF (Fourth Form Factor) SIM card. Smaller than ever, the Nano-SIM was the most futuristically compact SIM card at the time. The Nano-SIM (4FF) was developed to meet industry demands for even more compact designs without

MATSUKO and Telefónica have announced the launch of a spatial computing experience of holographic meetings, developed in collaboration with NVIDIA, which will enable creators to connect and collaborate as holograms in real-time. With their smartphone camera, users can enter holographic meetings as real themselves in 3D, share their 3D creations and access a new and