nuSIM – the integrated SIM for IoT
Join us for a webinar with Qualcomm Technologies and Deutsche Telekom discussing the capabilities, benefits and commercial adoption of nuSIM.
nuSIM is a new approach to integrated SIM technology, specifically developed for use in the Internet of Things (IoT) sector where simplicity, cost efficiency and low power consumption are of paramount importance.
Sebastiano Di Filippo, Senior Director Business Development, Qualcomm Europe, Inc. and Stefan Kaliner, Head of UICC Development, Deutsche Telekom will discuss:
- what nuSIM is
- the relevance and importance to the IoT sector
- the Qualcomm® 9205 LTE modem, next-generation global multi-mode single chipset connectivity solution, purpose-built to support reliable and optimized cellular connectivity for IoT applications
- possible IoT applications
Qualcomm Technologies has enabled Deutsche Telekom’s nuSIM solution on the Qualcomm® 9205 LTE modem, allowing device manufacturers to port nuSIM compliant applications onto devices containing the Qualcomm 9205 LTE modem. Deutsche Telekom has worked with various industry leaders, including Qualcomm Technologies, on the basis of a shared specification to create an open and fully interoperable ecosystem from concept stage through to implementation.
Submit your questions when you register and we will answer as many of them as we can during this live webinar. Register now >>
24th September | 3pm UK
Duration: 60 min.
Head of UICC Development
Stefan Kaliner has held several technical positions at Deutsche Telekom in Germany, since 1993. In his current role as Head of UICC Development he is responsible for the evolution of SIM cards within the international Deutsche Telekom Group. This spans multiple responsibilities such as leading mobile payment and eSIM projects and active participation in international standardization at 3GPP, ETSI and the GSMA. He initiated, and is the program lead for nuSIM, Deutsche Telekom’s open solution of an integrated SIM for IoT. Stefan holds several innovation awards and holds a master’s degree in Electrical Engineering from the University of Dortmund, Germany.
Sebastiano Di Filippo
Senior Director Business Development
Qualcomm Europe, Inc.
Sebastiano Di Filippo is Director, Business Development at Qualcomm Europe, Inc. In this role, he is responsible for the promotion, development and adoption of products, solutions and technologies spanning connectivity, automotive and Internet-of-Things (IoT) markets. Di Filippo also leads the Industrial IoT business development activities across Europe. Prior to joining Qualcomm, he held engineering and technical marketing roles at Agilent, Siemens and ANS spa. He started his professional career developing a new Viterbi equalizer for GSM systems. Di Filippo holds a master’s degree in Electrical Engineering from the UNIVAQ University – University of L’Aquila, Italy.
Editorial Director & Publisher
IoT Now & VanillaPlus
Jeremy Cowan is Editorial Director of the publishing group that has specialised in IT, Hi-Tech and Communications for 19 years. The group includes the international titles, www.IoT-Now.com, www.IoTGlobalNetwork.com, which focus on the Internet of Things and its impact on businesses and consumers, as well as www.VanillaPlus.com, the leading business information resource for Communication Service Providers and Network Operators worldwide.