Quectel’s steering towards smarter auto connectivity

Quectel Wireless Solutions will be participating as an exhibitor and keynote speaker at the upcoming Connected Auto & Electric Vehicles (CAEV) India event, set to take place in Bengaluru. This event gathers industry leaders, innovators and policymakers to discuss and showcase the latest trends, technologies and solutions in the connected auto and electric vehicle sectors.

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IoT and Industry 4.0 create a transformed manufacturing landscape

Industry 4.0, the Fourth Industrial Revolution, describes a transformation in the way we produce and manage goods that is driven by the integration of digital technologies into the core of the industrial production process. This production process is changing, regulated by the interconnection of machines and systems, the automation of production, learning machines and the

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Elevating industrial robotics: IAR and NexCOBOT’s partnership

IAR has announced the collaboration with NexCOBOT. IAR will be the Functional Safety solutions development partner of NexCOBOT to support its robot’s development by using the certified IAR Embedded Workbench for Arm to advance the future of smart manufacturing with collaborative robots.

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Cellular smart manufacturing set to triple by 2028

A new report by connectivity experts Kaleido Intelligence has found that cellular smart manufacturing deployments will grow to over 150 million connections, almost trebling 2023 deployments.

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Cellular IoT devices set to reach 6.5 billion by 2028

A new study by Juniper Research has found the global number of cellular IoT devices will increase from 3.4 billion in 2024 to 6.5 billion by 2028. However, the study predicts this 90% growth in connections will require the deployment of new services enabling the efficient automation of IoT device management and security.

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Dexory launches robotics AI in U.S. with DB Schenker

Dexory has announced the first deployment of its robotics and artificial intelligence solution in the United States. Dexory’s technology is now in use at one of DB Schenker’s significant sites in Utah. This follows Dexory’s expansion announcement into the North American market in early February.

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Laird Connectivity releases new sub-GHz FlexDipole Antenna

Laird Connectivity has announced the release of the sub-GHz FlexDipole Antenna, engineered to influence the standards of sub-GHz wireless communication. This state-of-the-art antenna is meticulously designed to support the 863 MHz – 928 MHz frequency range, making it a perfect fit for sub-GHz solutions such as LoRaWAN, Sigfox and Proprietary RF.

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Mobily enhances network operations with Ericsson’s AI solutions

Ericsson and Etihad Etisalat (Mobily) have extended their managed services agreement for a further three years to use next-generation Artificial Intelligence (AI) and Machine Learning (ML) for autonomous operations.

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Kerlink and Actility make IoT connectivity alliance

Kerlink and Actility have announced a partnership that builds on complementary strengths of their products and supports a plug-and-play, edge computing LoRaWAN ecosystem in a single solution. Under the partnership, Kerlink’s Wirnet iFemtoCell and Wirnet iStation gateway suite, which combines a LoRaWAN plug-and-play edge solution and guaranteed gateways, are integrated with Actility’s ThingPark All-in-One (TAO) platform that

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IoT moves to large deployments

The IoT market is set for continued robust growth up to 2030, writes Robin Duke-Woolley, the chief executive of Beecham Research. According to Statista, almost 30 billion IoT devices are expected to be connected by 2030, up from nearly ten billion in 2020 – a CAGR of nearly 12% over the decade. This includes both

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BTI introduces MORAN: The future of flexible network solutions

The Mobile World Congress 2024 kicked off in Barcelona and BTI Wireless, among the 2400 exhibitors, seized the opportunity to unveil its latest product and technological advancements over the four-day event. With a commitment to meeting evolving market demands and driving industry innovation, BTI presented a unique product set to influence both carrier and enterprise networks.

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Fibocom collaborates with industry partners to accelerate 5G RedCap commercialisation in extended markets

Fibocom has announced a momentum of implementing deployable and commercialised 5G RedCap module solution to 5G IoT scenarios, in collaboration with well-known customers including but not limited to Askey, Quanta Computer, PLANET, companies of whom have profound influence in the vertical markets respectively. Engineering testing and verification has been conducted to ensure the seamless integration

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CloudRAN.AI debuts software-driven private 5G solutions at MWC 2024

CloudRAN.AI has made its official debut at the Mobile World Congress (MWC) 2024 in Barcelona. The firm specialises in providing pure software-driven Private 5G network solutions, tailored for vertical industries seeking to harness the power of edge cloud computing and AI to fuel their digital transformation.

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Navigating the next horizon of SIM technology

With that, we come to the end of this riveting exploration into the evolution of the SIM card. From the format-one SIM cards that resembled credit cards, to the embedded and integrated SIM cards of our future, we have come a long way from the days when the whole device had to fit into your

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Fibocom collaborates with STMicroelectronics to debut smart home solution at MWC Barcelona 2024

Fibocom has announced the collaboration with STMicroelectronics in launching the  smart home solution using the Matter-compatible technologies, STM32WB55 and FG370. It ensures the centralised control of smart home devices across different protocols, allowing smart home devices to interact smoothly.

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Fibocom bolsters on-device intelligence with newly launched smart module SC208 based on Snapdragon 460 mobile platform at MWC Barcelona 2024

Fibocom launches a highly integrated multi-mode smart module SC208 with gigantic performance leaps in 4G category and a series of feature-packed multimedia experience improvements during MWC Barcelona 2024. Powered by the Snapdragon 460 mobile platform with an octa-core processor (4*A73 1.8GHz + 4*A53 1.6GHz) and with a high-performance graphics processing unit (GPU), the module is

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