Cadence

Cadence Design Systems, Inc. has announced an expanded collaboration with Samsung Foundry. This collaboration will accelerate 3D-IC design development for applications like hyperscale computing, 5G, AI (artificial intelligence), IoT (Internet of Things) and mobile.

Cadence Design Systems, Inc., has announced that it has welcomed Kudan and Visionary.ai to the Tensilica software partner ecosystem, bringing simultaneous localisation and mapping (SLAM) and AI image signal processor (ISP) solutions to Cadence Tensilica Vision DSPs and AI platforms. The broad Tensilica vision and AI software ecosystem includes more than 50 partners developing solutions for these

United Microelectronics Corporation, a global semiconductor foundry, and Cadence Design Systems, Inc. has announced that Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market.

Cadence Design Systems, Inc. has announced the LPDDR5X memory interface IP design optimised to operate at 8533Mbps up to 33% faster than the previous generation of LPDDR IP. Available now for customer engagements, the Cadence LPDDR5X IP boasts a new high-performance, scalable and adaptable architecture based on Cadence’s proven and highly successful LPDDR5 and GDDR6 product

San Jose, United States – Cadence Design Systems, Inc. announced Xcelium apps, a portfolio of domain-specific technologies implemented natively on the Cadence Xcelium logic simulator kernel that enable automotive, mobile and hyperscale design teams to achieve the highest verification performance. By mixing and matching Xcelium apps, customers can achieve up to a 10X regression throughput improvement.

Samsung Electronics, a provider in advanced semiconductor technology, announced the launch of ‘Samsung Advanced Foundry Ecosystem (SAFE™) Cloud Design Platform (CDP)’ for fabless customers, in collaboration with Rescale, a provider in high performance computing (HPC) applications in the cloud.

Signaling a new era in the world of multi-standard connectivity for the digital world, Alphawave IP Incorporated (“Alphawave”) is pleased to announce the delivery of its AlphaCORE 1-112Gbps multi-standard Serialiser-Deserialiser (“MSS”) Silicon IP solution to its first customers in the datacentre and networking market segments.

Cadence Design Systems, Inc. announced that Realtek Semiconductor Corp. used the Cadence® Innovus™ Implementation System for its 28nm Digital TV (DTV) System-on-Chip (SoC) production tapeout and achieved an area improvement and reduced power.