Huawei has launched its 5G multi-mode chipset Balong 5000 – along with the first commercial 5G device powered by it, the Huawei 5G CPE Pro.
Synchronoss Technologies, Inc., a global provider of cloud, messaging, digital, and IoT products, has joined the AT&T Smart Cities Strategic Alliance to help transform cities around the world. Its digital and IoT product portfolio and expertise will be leveraged by some of the mobile industry’s biggest names
Internet of Things (IoT) newcomer, Riot Micro is claiming that a radical design approach applying BLE/Wi-Fi architecture has delivered a new cellular IoT solution with cost/power levels that are characteristic of short-range wireless systems. Here Peter Wong, CEO, tells Jeremy Cowan how Riot has reinvented itself as an IoT chipset maker.
Altair Semiconductor, a provider of LTE chipsets, reports that the ALT1210 LTE-M chipset has successfully completed AT&T’s ADAPT chipset validation process. The ADAPT validation improves time-to-market and reduces the cost associated with the introduction of new Internet of Things (IoT) devices.
Broadcom Ltd. is rumoured to be considering a bid of up to US$100 billion for Qualcomm Inc., according to a report by Bloomberg. As Jeremy Cowan writes, if it goes ahead this could be one of the biggest ever acquisitions of a chipmaker.
HomeGrid Forum has announced that Donna Yasay will be stepping down as president following a successful two years with the Forum. Under Donna’s leadership, the HomeGrid Forum says it has flourished in the networking and communications market, ensuring G.hn products are multi-vendor interoperable even with multi-vendor silicon.
u-blox, a global provider in wireless and positioning modules and chips, and SIM Technology Group Limited announced that they will not proceed with the sale, respectively acquisition, of SIMCom cellular module product line.
Greenwave Systems’ new AXON Platform® for Conversational IoT is a carrier-grade smart gateway that supports a hands-free, voice-activated speaker with a customisable wake-up word and open architecture.
Raleigh, North Carolina, USA. (BUSINESS WIRE) –Telit Wireless Solutions, a global vendor of M2M modules and value-added services, has introduced the UE910 V2 HSDPA and HE910 V2 HSPA+ modules based on Qualcomm Technologies, Inc. chipsets
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