The Kudelski Group, the provider in digital security, and u‑blox, a provider in positioning and wireless communication technologies for the automotive, industrial and consumer markets, announced the signing of an MOU to bring premium-grade security to IoT devices.
Lantronix, Inc., a global provider of secure data access and management solutions for the industrial Internet of Things (IoT), announced the launch of its xPico 200 embedded IoT gateways.
Sierra Wireless, the provider of fully integrated device-to-cloud solutions for the Internet of Things (IoT), announced the BX Series Wi-Fi and Bluetooth combo modules with built-in cloud services and security features.
Athens International Airport (AIA), in Greece, has increased the number of passengers by more than 10% in the last year. Approximately 20 million passengers went through its gates in 2016 setting a new traffic record for Athens.
LTE for IoT chipmaker Sequans Communications S.A. announced that the first Huawei module based on Sequans’ Monarch LTE-M/NB-IoT platform is now available.
Altair Semiconductor, a provider of LTE chipsets, announced that samples of its new dual-mode FourGee-1210 CAT-1/CAT-M chipset will be available later this year, enabling a smooth transition to the next standard of Cellular IoT networks.
Altair Semiconductor chipsets are to power a new set of LTE modules that will help businesses lower costs and improve device performance for a broad range of Internet of Things (IoT) applications.
CALLUP, a provider of Mobile Device Management (MDM) and Value Added Services (VAS) solutions for the telecom industry since 1999, announced an Internet of Things (IoT) SIM card management system.
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