Foxconn
Infineon, Foxconn partner on SiC collaboration, leverage respective skill in EV development
Infineon Technologies AG, a global provider in automotive semiconductors, and Hon Hai Technology Group (“Foxconn”), an electronics manufacturing services provider, aim to establish a long-term partnership in the field of electric vehicles (EV) to jointly develop advanced electromobility with intelligent features. The memorandum of understanding (MoU) focuses on silicon carbide (SiC) development, leveraging Infineon’s automotive
Read moreNXP collaborates with Foxconn on next generation vehicle platforms
The Netherlands, 20 July 2022 – NXP Semiconductors has announced that it has signed a memorandum of understanding with Hon Hai Technology Group (“Foxconn”) to jointly develop platforms for a new generation of smart connected vehicles. Hon Hai (Foxconn), the electronics manufacturer and a technology solution provider, will leverage NXP’s portfolio of automotive technologies and
Read moreStellantis and Qualcomm collaborate to power new vehicle platforms with snapdragon digital chassis solutions
London, UK. 14 April 2022 – Stellantis N.V. and Qualcomm Technologies, Inc., announced a multi-year technology collaboration to utilise the latest Snapdragon Digital Chassis advancements to deliver intelligent, customisable and immersive in-vehicle experiences to millions of vehicles across Stellantis’ 14 iconic automotive brands beginning in 2024. Leveraging the Snapdragon Cockpit Platforms and 5G capabilities for telematics systems, Stellantis will have the
Read moreHPE opens Geneva IoT Innovation Lab to capitalise on edge data
Hewlett Packard Enterprise (HPE) has opened a new IoT Innovation Lab in Geneva, Switzerland. It is designed to help customers make use of the large amounts of data generated by devices, machines, assets and sensors working at the network edge. As an HPE spokesman tells, IoT Now‘s editorial director, Jeremy Cowan, the edge is anywhere outside data centres.
Read moreActility raises US$75m Series D funds to speed industrial IoT solutions globally, adds new backers
Actility, a provider of Low Power Wide Area Networks (LPWAN) for the Internet of Things (IoT), has successfully completed its Series D funding round. The company has raised $75 million to enhance its IoT solutions portfolio.
Read moreActility appoints high-tech business veteran Mike Mulica as Chief Executive Officer
Actility, the industry provider in Low Power Wide Area (LPWA) radio networking and the innovator behind the ThingPark IoT solution platform, has announced the appointment of high-tech business veteran Mike Mulica as Chief Executive Officer.
Read moreSequans and Foxconn subsidiary Socle form LTE for IoT strategic partnership
LTE chipmaker Sequans Communications S.A. and system-on-chip designer Socle Technology Corp., a fully-owned subsidiary of Foxconn announced a strategic partnership to address the global market for the LTE-enabled Internet of Things (IoT).
Read moreActility wins $25m investment led by Ginko Ventures, KPN, Orange and Swisscom
Paris, France – Actility, a provider of network solutions and managed information systems for the Internet of Things (IoT), has secured a $25 million funding round led by Ginko Ventures.
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