Silicon Labs expands senior management team to drive growth

Silicon Labs, a provider of silicon, software and solutions for a smarter, more connected world, announced two new executive appointments.

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LTE antennas and a TransferJet solution among Antenova’s new offerings at Embedded World

At Embedded World this year (Stand 5.141) Antenova will be showing an antenna solution for TransferJet, the new close-proximity wireless standard; new, flexible, FPC antennas for WLAN, ISM, Cellular/LTE and GNSS.

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Microsoft makes Azure IoT hub generally available, adds new device partners for developers

Microsoft’s new Azure IoT Hub is reportedly designed to provide an easy, secure way to connect, provision and manage billions of IoT devices sending and receiving trillions of messages per month.

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Connected home of the future approaches – slowly

The Internet of Things (IoT) push will continue for manufacturers, in 2016 this will still be a technology push rather than a consumer pull.

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Broadband World Forum to discuss and demonstrate the global Internet of Things

Expert speakers at this year’s Broadband World Forum will tackle the issues surrounding how the Internet of Things (IoT) can be delivered and monetised. The conference programme will be complemented by live demonstrations of pioneering IoT technologies by a number of specialist providers who will be present on the exhibition floor.

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ARM aligns with Microsoft Azure ondevelopment board for IoT products

Microsoft has certified the ARM mbed Enabled Freescale FRDM-K64F development board for Internet of Things (IoT) products that securely gather and channel data into the public cloud platform, Microsoft Azure.

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M2M Connecting the next 50 billion event in Glasgow

A free-to-attend event, described as an industry-led meeting of minds on M2M (machine-to-machine) communication is to be held at Freescale in Glasgow, Scotland Thursday November 24.

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Qualcomm Atheros adds WiFi to Freescale M2M controllers

Qualcomm Atheros, in a collaboration with Freescale, has created a tiny SIP chip package which will hold a full WiFi connection for machine to machine (M2M) applications, measuring just 8.3 mm by 9.2 mm

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