Georges Karam

eLichens, announced collaboration with Sequans, resulting in recent development of its Avolta, natural gas detector (NGD). This recent edition of Avolta harnesses power of NB-IoT/LTE-M (NarrowBand-internet of things / long term evolution for machines) technology, utilising Sequans’ monarch-2 platform.

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, and Sequans Communications S.A. have announced that two companies have entered into a MoU (memorandum of understanding). Pursuant to the terms of the MoU, Renesas will, following consultation of the Sequans’ works council and favourable recommendation by Sequans Board, commence a tender offer to acquire all outstanding

Paris, France. 22 February 2023 – Sequans Communications S.A., a provider of cellular IoT chips and modules, and Eseye, a provider of IoT connectivity solutions, have joined forces to deliver the universal iSIM (integrated eUICC) connectivity solution targeting the GSMA eSIM M2M standard. The solution will reduce the complexity and cost of IoT deployments providing

Munich, Germany – Skyworks Solutions, Inc., and Sequans Communications S.A., introduced the SKY66431, a 5G IoT SiP (system-in-package) solution. This next-generation SiP combines Sequans’ Monarch 2 modem with Skyworks’ RF front-end solution, creating the world’s smallest LTE-M/NB-IoT connectivity platform in a single package.

Munich, Germany and Tokyo, Japan – Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is expanding its low-power WAN product line as part of its strategy to deliver connectivity devices used for smart cities, smart homes, medical devices and industrial applications.

Tokyo, Japan – Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced two new cloud development kits, CK-RA6M5 and CK-RX65N, providing a complete connectivity solution for the RA and RX Families of 32-bit microcontrollers (MCUs). The cloud kits are to be equipped with Renesas’ RYZ014A Cat-M1 module, a certified LTE cellular module that

Sequans Communications S.A. announced that its second-generation LTE Cat 1 chip platform, Calliope 2, will soon be sampling. Calliope 2 is designed for the cost-effective support of IoT applications that require VoLTE and a data rate higher than 100 kilobits per second that cannot be supported by LTE-M or NB-IoT technologies.

LTE for IoT chipmaker Sequans Communications S.A. has formalised an agreement with NTT DOCOMO, the Japan-based mobile operator, to accelerate the development of LTE-M devices and applications on DOCOMO’s network, using Sequans’ Monarch LTE Platform, the world’s most highly optimised LTE-M chip solution.

LTE for IoT chipmaker Sequans Communications S.A. has announced that its Calliope LTE Cat 1 Platform is powering Geotab’s new GO8Ⓡ device, an open-platform telematics solution for fleet management unveiled at the Mobile World Congress.

LTE for IoT chipmaker Sequans Communications S.A. announced that the first Huawei module based on Sequans’ Monarch LTE-M/NB-IoT platform is now available.

Digital; security provider, Gemalto is partnering with LTE chipmaker Sequans Communications S.A. with the aim of “revolutionising Internet of Things (IoT) connectivity with LTE-M technology,” according to the partners.

Sequans Communications S.A. announced successful completion of interoperability testing of Sequans’ Calliope Cat 1 LTE chipset with NTT DOCOMO, Inc. Japan’s mobile operator.

LTE chipmaker Sequans Communications S.A. partnered with digital security provider, Gemalto in the LTE category 1 (Cat 1) market by developing a new set of narrowband LTE MTC solutions.

LTE chipmaker Sequans Communications S.A. introduced Monarch, the industry’s first LTE Cat M chip, compliant with the 3GPP Release 13 LTE Advanced Pro standard that defines new narrowband capabilities of LTE for machine-type-communications (LTE MTC).

Sequans Communications S.A. and Verizon announced joint activities to accelerate commercial realisation of Category M (CAT M) LTE products based on the coming Release 13 of the 3GPP LTE standard. Release 13 defines new features such as extended coverage, lower data rate and lower power consumption called for by a new class of LTE applications

LTE chipmaker Sequans Communications S.A. and system-on-chip designer Socle Technology Corp., a fully-owned subsidiary of Foxconn announced a strategic partnership to address the global market for the LTE-enabled Internet of Things (IoT).