Fibocom announces a smart module for IoT change

Fibocom has announced the release of a new LTE smart module SC228 for the acceleration of digital transformation in smart retailing, smart wearable camera, Industrial IoT, In-vehicle infotainment market. Integrated with a 6nm processor, the module utilises the powerful CPU and GPU to deliver superior multimedia performance while conserving power. Compatible with frequency bands worldwide,

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Dihuni ships optiReady GPU servers for generative AI, LLM applications

Dihuni announced that it has started shipping optiReady GPU (graphics processing unit) servers and workstations designed for generative AI (artificial intelligence) and LLM (large language model) applications. These pre-configured systems are designed to make generative AI infrastructure selection simple and accelerate deployment from procurement to running applications.

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AI chipsets, solving current and future industry problems

Semiconductors power the electronically pervasive modern world. Artificial Intelligence (AI) is destined to support a vast number of technologies ranging from self-driving vehicles to social media analytics. The combination of AI with semiconductors represents a logical next step for silicon providers to embed AI into virtually anything that requires a processor says the author Gerry

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AMD and IMSCAD collaborate to simplify design engineering migration to virtualisation in private or public clouds

IMSCAD Global, an IT services company is to team up with AMD, a global provider of CPU and GPU technology.Together they intend to deliver advanced solutions that simplify the transition to graphics virtualisation for Architecture, Engineering, Construction Design and Manufacturing firms.

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Google leads in AI powered smartphones

According to the latest research from Strategy Analytics, one out of every three smartphones sold worldwide this year will use artificial intelligence (AI) to power virtual assistants. But cloud-based AI which powers virtual assistants results in slower response times – On-device machine-learning will significantly speed smartphone AI.

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CEVA and LG Electronics partner for smart 3D camera solution

CEVA, Inc., the licensor of signal processing IP for smarter, connected devices, announced a partnership with LG Electronics, a provider in consumer electronics and appliances, to deliver a high-performance, low-cost smart 3D camera solution for consumer electronics and robotic applications.

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New Quick Start Solution from MapR accelerates deep learning application deployments

MapR Technologies, provider of the Converged Data Platform that enables organisations to create intelligent applications that fully integrate analytics with operational processes in real time, announced at Strata London a new Quick Start Solution (QSS) focusing on deep learning applications.

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Qualcomm introduces new platform naming structure as ‘processor’ doesn’t capture its anthology of technology

Over the coming months, Qualcomm Technologies will roll out changes and updates to our product brand positioning to best articulate the value of our technology and products for our customers and their end users.

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Qualcomm Technologies stops calling Snapdragon a processor, preferring ’platform’ to represent its solutions suite

Over the coming months Qualcomm is to roll out changes and updates to its product brand positioning to better articulate the value of Qualcomm’s products.

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Will Qualcomm’s acquisition of NXP Semiconductors trigger a new wave of market consolidation?

Qualcomm, the smartphone chipmaker, has acquired NXP Semiconductors for US$47 billion in the largest semiconductor acquisition of all time, says Yiru Zhong, senior industry analyst, Digital Transformation, Frost & Sullivan. (Also see: Qualcomm focuses on IoT as it agrees to buy chipset maker NXP Semiconductors for US$47bn.)

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CEVA introduces a new DSP-based offering bringing deep learning and Artificial Intelligence capabilities

CEVA, Inc, licensor of signal processing IP for smarter, connected devices, has introduced a new DSP-based offering bringing deep learning and Artificial Intelligence (AI) capabilities to low-power embedded systems.

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Qualcomm introduces Virtual Reality software development kit

Qualcomm Inc’s subsidiary, Qualcomm Technologies, Inc., has introduced a new virtual reality (VR) software development kit (SDK).

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congatec reports it has tripled the graphics performance of its Server-on-Modules

congatec, a provider of embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, has added a “powerful graphics version” to its COM Express Basic Server-on-Module portfolio.

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Low latency, high performance video processing circuit block built by Renesas for autonomous driving

Renesas Electronics, a supplier of advanced semiconductor solutions, today announced the development of a new video processing circuit block for use in automotive computing system-on-chips (SoCs) in future autonomous vehicles.

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ARM claims improved efficiency and experiences on wearable and IoT devices from Mali-470 GPU

ARM has released a new highly-efficient graphics processing unit (GPU) to enable smartphone-quality visuals on wearable and Internet of Things (IoT) devices.

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