Micron Technology, Inc, a provider of memory and storage solutions, introduced the industry’s first 1TB automotive and industrial grade PCIe NVM solid state drive (SSD) in BGA and 22x30mm M.2 form factors at Electronica 2018.
NetFoundry announced its partnership with Micron Technology, Inc. and Tata Communications to provide zero trust silicon-to-cloud secured connectivity via any
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Inc., has launched its next generation Qualcomm Snapdragon Wear 3100 platform for smartwatches.
At the Huawei Global Analyst Summit 2018 (HAS 2018), the Japanese Internet company CyberAgent, Inc. made the following announcement with Huawei: With the help of Huawei’s CloudFabric solution, CyberAgent, Inc.
AIM, Inc., NFC Forum and RAIN RFID Alliance unveiled a partnership to establish and deliver the Connections Summit on March 7, 2018 at Google Java Corners, Sunnyvale, CA. The Connections Summit is a one-day event featuring over 25 speaker-led sessions, panel discussions, case studies and networking opportunities focusing on how Automatic Identification and Data Capture (AIDC),
IIoT (Industrial Internet of Things) real-time, web-connected leased Pick-to-Light devices are the best choice for more than 90% of the distribution, warehouse, and cellular manufacturing assembly markets. According to Trevor Blumenau, CEO of Voodoo Robotics,
Dell has announced new and promoted partners to the Dell Internet of Things (IoT) Solutions Partner Program and winners of the “Connect What Matters” IoT Contest.
A recent survey conducted by Lux Insights, Inc. puts consumer awareness of Bluetooth wireless technology at 92% globally, with 62% of respondents reporting a purchasing preference for Bluetooth enabled products, noting Bluetooth is reliable, easy to use, and makes life easier.
Red Hat, Inc., a provider of open source solutions, announced the general availability of Red Hat Cloud Suite and Red Hat OpenStack Platform 8. This is designed to bridge the gap between development and operations teams at the scale of cloud computing.
As semiconductor scaling continues, the microelectronics industry faces a new inflection point, building upon the heterogeneous integration of leading-edge and mature technologies, and driving ‘smart’ system level applications which will transform the industry.
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