Infineon’s AIRO cloud connectivity manager supports the AWS IoT expressLink

Munich, Germany, and San Jose, California. 30 November 2021 – Infineon Technologies AG announced the company’s new AIROC IFW56810 Cloud Connectivity Manager (CCM) solution supports the AWS IoT ExpressLink standards and specifications. This combined offering makes it easier and faster for companies and end customers to connect products such as industrial sensors, home appliances, irrigation systems

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Infineon and Hyundai Motor Group to nurture startups focusing on future mobility and digitalisation

Munich, Germany, Seoul, South Korea and Singapore. October 27, 2021 – Semiconductors are at the core of emerging technologies that enable digital transformation. To amplify startup engagement Infineon Technologies AG has signed a memorandum of understanding with Hyundai Motor Group.

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Infineon and Rainforest Connection create real-time monitoring system to detect wildfires

Munich and San Jose, California, 21 October, 2021 – Infineon Technologies AG a provider of semiconductors for mobility, energy efficiency and the IoT, announced a collaboration with Rainforest Connection (RFCx), a non-profit organisation that uses acoustic technology, Big Data and Artificial Intelligence / Machine Learning to save the rainforests and monitor biodiversity.

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Infineon simplifies secure IoT device-to-cloud authentication with CIRRENT Cloud ID service

Munich, Germany. 21 October 2021 – Infineon Technologies AG launched CIRRENT Cloud ID, a service that automates cloud certificate provisioning and IoT device-to-cloud authentication. The easy-to-use service extends the chain of trust and makes tasks easier and more secure from chip-to-cloud, while lowering companies’ total cost of ownership. Cloud ID is ideal for cloud-connected product companies

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Switched capacitor intermediate bus converter delivers high power density for 48 V data centre applications

Flex Power Modules introduces the BMR310, a non-isolated switched capacitor intermediate bus converter (IBC) which provides high power density for data centres, thus improving board space utilisation and freeing space for other components.

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PSoC 64 standard secure MCU family achieves PSA level 2 certification for more secured IoT devices

Infineon Technologies AG announced the company has achieved the Arm Platform Security Architecture (PSA) Level 2 certification for the PSoC 64 microcontrollers (MCUs) standard secure family of devices.

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Screenless wristband enables communication and contactless payment with innovative biometrics

The IoT (Internet of Things) building blocks from Infineon Technologies AG are becoming ever more powerful, energy-efficient, and smaller. Today, practically any everyday object can be enriched with smart functions to make life easier.

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Infineon appoints Constanze Hufenbecher to new transformation role

Infineon Technologies AG is creating a new management board position of chief digital transformation officer (CDTO), effective from April 15th, 2021. The supervisory board has appointed Constanze Hufenbecher to the post.

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Infineon and DIGISEQ develop secured physical asset verification for brand protection

In a joint project, Infineon Technologies AG and DIGISEQ, an IoT platform provider with end-to-end service, utilise SECORA Blockchain NFC technology to deliver secured identity data.

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Connected home evaluation kit unveiled: Infineon prototyping platform supports Zigbee Alliance’s new CHIP standards

Infineon Technologies AG simplifies the design and implementation of secured smart home devices with a new evaluation kit based on an OPTIGA™ Trust M security solution for Raspberry Pi.

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New 650 V CoolMOS CFD7 is tailored to perform in resonant topologies

For SMPS designs in industrial applications, recent technology trends include the need for high efficiency and power density as well as increased bus voltages. This triggers the need for power devices with 650 V breakdown voltage.

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Most Germans willing to pay significantly more for data security in smart homes

Summertime is the season for traveling, making it the peak season for burglars. As a result, more and more consumers are keeping a remote eye on their home via camera and smartphone app.

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Infineon and GoerTek optical sensor solutions deliver precise, ultra-low power heart rate monitoring for smart devices

Infineon Technologies AG and GoerTek Inc. has launched two high-resolution, highly integrated optical sensors. The optical chips deliver the precise measurement, small size and ultra-low power consumption demanded by ambient light sensing, proximity detection, heart rate and pulse oximetry monitoring applications in smart devices. The sensor solutions offer best-in-class performance for headphones, fitness bands, smart

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Lenovo selects Infineon Secure Element chip for Vibe P1 and Lenovo X3 smartphones

Enabling secured mobile payment based on NFC technology: Infineon Technologies AG has announced that it supplies the embedded Secure Element (eSE) chip for the latest Lenovo smartphones.

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Barcelona improves smart mobility with Infineon’s CIPURSE™-based security solutions

Barcelona is Spain’s second largest urban area and according to Juniper Research one of the smartest cities in 2015. The new “T-Mobilitat” electronic fare collection system will further improve urban mobility. Infineon Technologies AG supplies the security chips for the “T-Mobilitat” infrastructure – for both the chip-based tickets, that work contactless, as well as validators based

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