TSMC, Bosch, Infineon, NXP create joint venture for advanced semiconductor nanufacturing in Europe

TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. have announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services. ESMC advances in its efforts to build a 300mm fab, aimed at catering to the growing capacity demands of the automotive and industrial

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Semiconductor companies join forces to accelerate RISC-V

Semiconductor companies Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor, NXP Semiconductors, and Qualcomm Technologies, Inc., have come together to jointly invest in a company. This aims at advancing adoption of RISC-V (reduced instruction set computer-five) globally by enabling hardware development.

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FMI reports eSIM subscription market to open up new avenues for telecom sector business

The worldwide eSIM subscription market net value is forecast to reach over US$980 million (€898.00 million) in 2023, with a compound annual growth rate (CAGR) of 30% expected from 2023 to 2033. According to this analysis of the embedded Subscriber Identity Module (eSIM) subscription industry analysis, the market’s entire worth would rise to US$13,510 million

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Infineon launches SLC26P security controller based on 28nm technology for payment applications

Munich, Germany. 29 November, 2022 – Commercial production of integrated circuits using 28 nm technology node began several years ago. As the process technology has matured, market demand for 28 nm products has also increased. Although offering numerous advantages, security applications have not been among the main applications of this technology, thus far. Today, Infineon

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Infineon introduces XENSIV TLE4971 sensor family for automotive applications

Munich, Germany – Infineon Technologies AG announced the addition of the XENSIV TLE4971 family to its current sensor portfolio for automotive applications. The 3.3 V devices are the next generation of TLI4971 devices available in a TISON package with an integrated rail and available in four different pre-programmed current ranges: 25 A, 50 A, 75

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Infineon introduces new CMOS transceiver MMIC CTRX8181 for automotive radar

Munich, Germany. 3 November, 2022 – A high-performance and reliable radar module is the key to an improved automated driving assistance system and autonomous driving in the future. New features, such as advanced emergency braking systems (AEBs) that react to crossing motorcyclists, will demand higher performance and increased modules per car. Key drivers for this

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New Dreame Bot W10 Pro vacuum cleaner features Infineon’s REAL3 Time of Flight image sensor

Munich, Germany. 28 October, 2022 – Dreame, a Chinese based company specialised in smart home cleaning devices, has launched its new vacuum cleaning robot, the Dreame Bot W10 Pro. The smart vacuum cleaner is equipped with a camera featuring the REAL3 Time of Flight (ToF) image sensor from Infineon Technologies AG and pmdtechnologies. The ToF

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Infineon delivers CIRRENT SaaS offering to optimise product development with intelligent data

Munich, Germany – Infineon Technologies AG is announcing its software as a service (SaaS) offering, Infineon’s CIRRENT IoT network intelligence (INI) – a cloud SaaS offering that helps IoT developers quickly and cost-effectively gather information about their products to increase reliability, improve product performance, and reduce support cost.

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Infineon launches a new IoT sensors platform XENSIV connected sensor kit

Munich, Germany. 26 October, 2022 – IoT ecosystems and connected devices enable new service offerings and peripheral services to be bought and unlocked. However, prototyping sensor-based IoT use cases can become a resource intensive process until smart IoT systems are ready to be deployed. To support hardware and software engineers in the development of IoT

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Infineon releases ModusToolbox 3.0, simplifies development of dual-core applications with support for simultaneous debug

Munich, Germany, 6 October, 2022 – As multicore devices become prevalent in the embedded microcontroller space, system designers face increasingly complex challenges in software development. To help accelerate time-to-market and simplify overall design, Infineon Technologies AG has announced the release of ModusToolbox 3.0 an improved development platform with enhanced support for multi-core project workflow. The release features

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Infineon introduces a new single-stage flyback controller for battery charging applications

Munich, Germany. 22 September 2022 – Battery-powered appliances, one of the segments, require energy-efficient, robust, and cost-effective battery charging. For this reason Infineon Technologies AG extends its offering of AC-DC controller ICs by introducing the ICC80QSG single-stage PWM controller for flyback topologies. The IC is tailored for battery charger applications offering scalable power designs of up to

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IFA 2022: Infineon showcases future of payments using connected devices in IoT, biometrics’

Munich, Germany. 11 August 2022 – Mobile and contactless payments, digital wallets and biometrics: future topics from a few years ago have now become part of our everyday lives. But how will we pay in the future? Will cash and banking cards disappear from our lives? And how will this change our daily lives?

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Infineon’s CoolSiC devices support bi-directional inverter from Delta to let EVs become emergency backup power

Munich, Germany. 26 July, 2022 – CoolSiC products from Infineon Technologies AG are adopted by Delta Electronics, a Taiwan-based global provider of power and energy management solutions, to allow for a big step towards energy transition and carbon neutrality with green power. With the successful development of bi-directional inverters, a hybrid three-in-one system that integrates solar,

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Electric cars as buffer storage for solar power: Infineon and Delta enable bidirectional charging at home

Munich, Germany. 27 July, 2022 – On hot summer days, the share of solar power in the energy mix reaches record levels. But what to do when the sun is not shining? With bidirectional charging, solar power from the photovoltaic system is stored in electric cars and home batteries and fed back into the home

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u-blox announces Seiler to step down as CEO in January 2023, Infineon’s Zizala joins in October to take over

Thalwil, Switzerland – Thomas Seiler is to step down as CEO on 31st December, 2022 after more than 20 years of leading the company. He will remain a member of the board of directors to advise. Stephan Zizala will assume the role of CEO on 1st January, 2023.

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Infineon welcomes the adoption of delegated articles 3.3 (d), (e), (f) of the radio equipment directive by the European Commission

Munich, Germany. 28 April, 2022 – Infineon Technologies AG is committed to enabling security for the Internet of Things (IoT) and applauds the adoption of delegated articles 3.3 (d), (e), and (f) of the European Commission (EC) Radio Equipment Directive (RED, 2014/53/EU), and its goal to provide security, safety, health and privacy outcomes for the consumer and industry.

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