Infineon Technologies AG

Infineon Technologies AG introduces the automotive qualified EasyPACK 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A . With its featured specs, the module is optimised for inverter applications in hybrid and electric vehicles.

A market research and competitive intelligence provider’s market intelligence report states the global driver alert system market is expected to exceed US$101 billion (€86.98 billion) by registering a healthy compound annual growth rate (CAGR) of 14% in the forecast period 2021-2031.

Flex Power Modules introduces the BMR310, a non-isolated switched capacitor intermediate bus converter (IBC) which provides high power density for data centres, thus improving board space utilisation and freeing space for other components.

Infineon Technologies AG announced the company has achieved the Arm Platform Security Architecture (PSA) Level 2 certification for the PSoC 64 microcontrollers (MCUs) standard secure family of devices.

Infineon Technologies AG and Robert Bosch GmbH are launching a new ultra-low-loss diode called Active Rectifying Diode for light vehicle generators.

What if your everyday eyeglasses became the next media for augmented reality applications? What if every car could display valuable data on the whole windshield to securely guide you through the traffic? The new MEMS* scanner solution from Infineon Technologies AG, comprising a MEMS mirror and MEMS driver, allows completely new product designs. Its miniature

The IoT (Internet of Things) building blocks from Infineon Technologies AG are becoming ever more powerful, energy-efficient, and smaller. Today, practically any everyday object can be enriched with smart functions to make life easier.

TomTom GO Discover, developed by TomTom, the location technology company, is one of the quick and powerful satnavs on the market today. The satnav with its 5, 6, and 7-inch display leverages the AIROC CYW43455 Wi-Fi and Bluetooth combo chip from Infineon Technologies AG.

Infineon Technologies AG introduced a new automotive power module with CoolSiC MOSFET technology. At this year’s virtual PCIM trade show, Infineon will present the new HybridPACK™ Drive CoolSiC™, a full-bridge module with 1200 V blocking voltage optimised for traction inverters in electric vehicles (EV).

Infineon Technologies AG is creating a new management board position of chief digital transformation officer (CDTO), effective from April 15th, 2021. The supervisory board has appointed Constanze Hufenbecher to the post.

In a joint project, Infineon Technologies AG and DIGISEQ, an IoT platform provider with end-to-end service, utilise SECORA Blockchain NFC technology to deliver secured identity data.

Infineon Technologies AG simplifies the design and implementation of secured smart home devices with a new evaluation kit based on an OPTIGA™ Trust M security solution for Raspberry Pi.

For SMPS designs in industrial applications, recent technology trends include the need for high efficiency and power density as well as increased bus voltages. This triggers the need for power devices with 650 V breakdown voltage.

Summertime is the season for traveling, making it the peak season for burglars. As a result, more and more consumers are keeping a remote eye on their home via camera and smartphone app.

Infineon Technologies AG and GoerTek Inc. has launched two high-resolution, highly integrated optical sensors. The optical chips deliver the precise measurement, small size and ultra-low power consumption demanded by ambient light sensing, proximity detection, heart rate and pulse oximetry monitoring applications in smart devices. The sensor solutions offer best-in-class performance for headphones, fitness bands, smart

Enabling secured mobile payment based on NFC technology: Infineon Technologies AG has announced that it supplies the embedded Secure Element (eSE) chip for the latest Lenovo smartphones.