Infineon

From now on, the RDK2 and RDK3 base boards from Rutronik System Solution are available in Infineon‘s ModusToolbox development environment. ModusToolbox is a modern development environment that offers support throughout the development process for new applications.

The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in the coming years.

Infineon Technologies AG introduces new XENSIV 60 GHz radar sensor BGT60UTR11AIP. With a compact size of 16 mm², it is the small 60 GHz radar sensor with antennas in package (AIP) on the market and is designed for integration into small devices.

In static switching applications, power designs focus on minimising conduction losses, optimising thermal behaviour, and achieving compact and lightweight systems while ensuring high quality at a low cost. To meet the needs of next-generation solutions, Infineon Technologies AG is expanding its CoolMOS S7 family of high-voltage superjunction (SJ) MOSFETs (metal-oxide-semiconductor field-effect transistor).

Infineon Technologies AG introduced two new Ferroelectric RAM (F-RAM) memory devices in 1Mbit and 4Mbit densities to its EXCELON F-RAM family. The 1Mbit devices are the automotive-qualified serial F-RAMs available .

High-performance embedded secure hardware has long been the prerogative of high-compute devices like PCs and smartphones. Today, as penetration into these devices flattens, fresh demand is coming from the IoT ecosystem, says ABI Research, a global technology intelligence firm.

Infineon Technologies AG has announced the launch of its Edge Protect embedded security solution. The new software solution has four categories of security configurations for customer requirements in IoT applications based on increasing security capabilities. Edge Protect is optimised for Infineon’s PSoC and AIROC family of products. The new solution also offers preconfigured product-security categories to

Infineon Technologies AG, a global provider in automotive semiconductors, and Hon Hai Technology Group (“Foxconn”), an electronics manufacturing services provider, aim to establish a long-term partnership in the field of electric vehicles (EV) to jointly develop advanced electromobility with intelligent features. The memorandum of understanding (MoU) focuses on silicon carbide (SiC) development, leveraging Infineon’s automotive

Munich, Germany, and Taipei, Taiwan. 14 April, 2023 – Infineon Technologies and Hi-Lo Systems, a Taiwan based IC programming and testing company, have announced their partnership in the area of Trusted Platform Module (TPM) security chips. Hi-Lo Systems has officially become an associated partner of Infineon in the Greater China market and will provide firmware

Infineon Technologies AG has announced its AIROC CYW20829 Bluetooth LE system on chip (SoC) is ready with the newly released Bluetooth 5.4 specification. With the right combination of low power and high performance, AIROC CYW20829 is designed to support the entire spectrum of Bluetooth low energy (LE) use cases including smart home, sensors, medical healthcare,

Infineon Technologies AG and United Microelectronics Corporation have announced a long-term cooperation agreement to multiply capacity for the production of Infineon automotive microcontroller in order to serve the expanding automotive market. The high-performance microcontroller product leverages Infineon’s proprietary eNVM (embedded non-volatile memories) technology and will be manufactured at UMC’s Singapore fab on its 40nm process.

Munich, Germany – Infineon Technologies AG is extending its cooperation with silicon carbide (SiC) suppliers. The German-based semiconductor manufacturer has signed a new multi-year-supply and cooperation agreement with Resonac Corporation, complementing and expanding the announcement of 2021.

New York, United States – Despite facing an increasingly volatile semiconductor industry plagued by ongoing macroeconomic and political issues, the secure microcontroller (MCU) market should fare well in the long term. While the forecasted total available market has contracted, especially in the smart home, retail, advertising, and supply chain spaces, secure MCU shipments will only be temporarily

Hsinchu, Taiwan – Faraday Technology Corporation, a ASIC design service and IP provider, announced it has collaborated with Infineon to develop a SONOS eFlash platform on UMC’s 40uLP process. This platform includes a newly developed eFlash subsystem IP and complete eFlash testing solution with easy-to-integrate and fast data access features.

San Francisco, United States – Memfault, a provider of IoT reliability platform, has announced its platform includes full support for embedded Linux. The expansion offers cross-platform support for RTOS, bare metal, Android, or Linux developers building on any hardware for any number of devices running any use case, anywhere.

Munich, Germany. 29 November, 2022 – Commercial production of integrated circuits using 28 nm technology node began several years ago. As the process technology has matured, market demand for 28 nm products has also increased. Although offering numerous advantages, security applications have not been among the main applications of this technology, thus far. Today, Infineon