Kurt Sievers
TSMC, Bosch, Infineon, NXP create joint venture for advanced semiconductor nanufacturing in Europe
TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. have announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services. ESMC advances in its efforts to build a 300mm fab, aimed at catering to the growing capacity demands of the automotive and industrial
Read moreNXP collaborates with Foxconn on next generation vehicle platforms
The Netherlands, 20 July 2022 – NXP Semiconductors has announced that it has signed a memorandum of understanding with Hon Hai Technology Group (“Foxconn”) to jointly develop platforms for a new generation of smart connected vehicles. Hon Hai (Foxconn), the electronics manufacturer and a technology solution provider, will leverage NXP’s portfolio of automotive technologies and
Read moreNXP and Ford collaborate to deliver next-generation connected car experiences
Eindhoven, Netherlands, 10 November 2021 – NXP Semiconductors announced a collaboration with the Ford Motor Company to deliver enhanced driver experiences, convenience and services across its global fleet of vehicles, including the 2021 Ford F-150 pickup, Mustang Mach-E and Bronco SUVs. Ford’s new fully networked vehicle architecture implements NXP’s vehicle networking processors and the i.MX
Read moreNXP and Baidu partner on Apollo open autonomous driving platform
NXP Semiconductors, the automotive semiconductor supplier and Baidu, Inc., the Chinese language search provider announced a cooperation in autonomous driving. Under the terms of the agreement,
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