microcontroller

Renesas Electronics Corporation introduced the RA2A2 microcontroller (MCU) Group based on the Arm Cortex-M23 processor. The new, low-power devices offer a 24-bit Sigma-Delta analog-to-digital converter (SDADC), and an innovative dual-bank code flash and bank swap function that make it easy to implement firmware over-the-air (FOTA) updates for smart energy management, building automation, medical devices, consumer

CommScope and STMicroelectronics have partnered to integrate CommScope’s PKIWorks IoT security platform with ST’s STM32WB microcontroller unit (MCU). This collaboration provides device manufacturers with a comprehensive answer for developing secure IoT devices that comply with the Connectivity Standards Alliance’s Matter standard.

Infineon Technologies AG has introduced the TLE988x and TLE989x families extending the company’s portfolio of MOTIX MCU (microcontroller unit) embedded power ICs (integrated circuit). By integrating a gate driver, microcontroller, communication interface and power supply on a single chip, Infineon’s system-on-chip solutions achieve a minimal footprint.

Toshiba has added new products ‘M3H group (2)’ to the ‘M3H group’ of the 32-bit microcontroller product group TXZ+ Family Advanced Class equipped with Cortex-M3 using the 40nm process.

Infineon Technologies AG and United Microelectronics Corporation have announced a long-term cooperation agreement to multiply capacity for the production of Infineon automotive microcontroller in order to serve the expanding automotive market. The high-performance microcontroller product leverages Infineon’s proprietary eNVM (embedded non-volatile memories) technology and will be manufactured at UMC’s Singapore fab on its 40nm process.

u-blox, a global provider of positioning and wireless communication technologies, and Arduino, providers of the world’s leading open-source hardware and software ecosystem, introduced four new boards to their MKR family, delivering enhanced wireless connectivity options for IoT applications.

Digi International®, a global provider of Internet of Things (IoT) connectivity products and services, has announced the availability of the Digi® XBee3™ series of next-generation RF modules and cellular modems.

NXP Semiconductors N.V, the supplier of automotive semiconductors, has announced an all new control and compute concept for connected, electric and autonomous cars. The NXP S32 platform is the world’s first fully-scalable automotive computing architecture.

Premier Farnell has created an IoT Power Calculator that aims to help developers of IoT (Internet of Things) projects to understand the expected battery life of their IoT devices. It also allows them to experiment with different components and software algorithms to determine their impact on battery life.

Trusted Objects, a specialist in security for the Internet of Things (IoT), has released its Secure Element (SE) designed for connected solutions on the Sigfox network.

Whilst the selection criteria for Cloud data storage focus on physical size, reliability, speed and power consumption, data storage at IoT nodes has different priorities.

The Internet of Things is evolving to provide greater intelligence at the node, converting raw data into smart information.

At the Wearable Technology Show in London, UK, MicroEJ® reported that Bong, a Chinese OEM, chose MicroEJ solutions when developing the software for its latest X2 smartwatch.

Intel Corporation has announced a new Intel® IoT Platform reference architecture and new hardware and software products as part of its effort to build out one of the most comprehensive offerings for the Internet of Things (IoT) marketplace.