LTE for IoT chipmaker Sequans Communications S.A. has formalised an agreement with NTT DOCOMO, the Japan-based mobile operator, to accelerate the development of LTE-M devices and applications on DOCOMO’s network, using Sequans’ Monarch LTE Platform, the world’s most highly optimised LTE-M chip solution.
Cambium Networks, a provider of wireless broadband networking solutions, announced it has executed an agreement with Ingram Micro as a new distributor. Under the agreement, Croatia-based Ingram Micro will distribute the full range of Cambium Networks’ products throughoutSoutheast Europe;
u‑blox, a provider in wireless and positioning modules and chips, will feature a live Narrowband IoT (NB‑IoT or LTE Cat NB1) demo at MWC Americas in San Francisco, featuring SARA‑R410M-02B, a configurable LTE Cat M1/NB1 multi‑mode module with worldwide coverage.
u‑blox, a global provider of wireless and positioning modules and chips, announced that it is partnering with key players of the IoT ecosystem, Huawei, Vivo, CAS Tecnologia and PinMyPet running lab and field tests inside new Narrowband IoT (NB-IoT or Cat NB1) networks in Brazil.
ZTE Corporation, an international provider of telecommunications, enterprise and consumer technology solutions for the mobile internet, released its Narrowband IoT (NB-IoT) Intelligent Energy Management System globally.
CyanConnode Holdings plc, a provider of narrowband radio mesh networks, reports new purchase orders for 10,400 smart meters from Larsen & Toubro. These expand the deployment of CyanConnode’s smart metering solution at Tata Power Mumbai.
At this year’s Mobile World Congress (MWC) in Barcelona (Feb 27- March 2) the Cologne-Berlin start-up ubirch will present a new technology for the Internet of Things (IoT).
Altair Semiconductor, a provider of LTE chipsets, has introduced the ALT1250, a narrowband CAT-M1 and NB1 (NB-IoT) chipset that aims to redefine the cellular IoT connectivity space, featuring global band support, advanced security and location capabilities far surpassing the functionality of existing chipsets.
In part 1 of this article we looked at how new ultralow-power RF transceiver technologies are bringing class-leading range performance and high resilience to interference sources.
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