Advantech unveils ROM-2620 OSM with NXP Semiconductors’ i.MX 8ULP SoC for AIoT endpoints

Advantech announces the release of ROM-2620 (read-only memory), its ‘Open Standard Module (OSM)’ designed to modernise AIoT (artificial intelligence of things) applications with its ultra-low power consumption and ultra-small size. The ROM-2620 adopted the OSM size-S form factor by the Standardisation Group for Embedded Technologies (SGET), and incorporates NXP Semiconductors’ i.MX 8ULP applications processor with integrated

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TSMC, Bosch, Infineon, NXP create joint venture for advanced semiconductor nanufacturing in Europe

TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. have announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services. ESMC advances in its efforts to build a 300mm fab, aimed at catering to the growing capacity demands of the automotive and industrial

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Impinj secures patent infringement lawsuits against NXP Semiconductors

Impinj announced that it has secured two RAIN RFID (radio-frequency identification) patent-infringement lawsuits. A federal jury in California found that NXP Semiconductors infringed two of Impinj’s patents, one willfully.

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Nitrogen93 SMARC system-on-module from Laird Connectivity delivers Wi-Fi 6, Bluetooth 5.3

Laird Connectivity has unveiled the Nitrogen93 in a smart mobility architecture (SMARC) form factor, expanding the SOM (system-on-module) portfolio and offering a solution that uses both processor and wireless silicon from NXP. The Nitrogen93 is powered by NXP’s i.MX 93 processor, NXP PMIC (power management integrated circuit) PCA9451A, and Laird’ Sona NX611 Wi-Fi 6 and

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U-blox launches new dual-band Wi-Fi 6, dual-mode Bluetooth 5.3 module

u-blox, a global provider of positioning and wireless communication technologies and services, has announced the u-blox JODY-W5, its new module tailored for the automotive market. With its dual-band Wi-Fi 6 and dual-mode Bluetooth 5.3 technologies, including LE Audio, the module is ideal for preventing wireless network congestion in the car and delivering enhanced audio functionalities. It

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InPlay announces collaboration for no-code connected sensor solutions with NXP Semiconductors

InPlay Inc, a provider of wireless connectivity SoC technology, has announced collaboration with NXP Semiconductors, a provider of secure connectivity solutions for embedded applications. This collaboration aim at development of connected sensors. The collaboration leverages InPlay’s NanoBeacon IN100 SoC and NXP’s ultra-low power 3-axis accelerometres, magnetic switch and pressure sensors to offer customers easy-to-use solution.

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SigmaSense announces technology licensing, co-development with NXP Semiconductors

Austin, United States – SigmaSense has announced a license and co-development with NXP Semiconductors to lead in the transition from traditional touch interfaces to multi-dimensional sensing capable of enhancing user experiences. SigmaSense has licensed technology to NXP, and the companies will collaborate on high-performance sensing products for specific applications with demands for faster, fully software-defined experiences.

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FMI reports eSIM subscription market to open up new avenues for telecom sector business

The worldwide eSIM subscription market net value is forecast to reach over US$980 million (€898.00 million) in 2023, with a compound annual growth rate (CAGR) of 30% expected from 2023 to 2033. According to this analysis of the embedded Subscriber Identity Module (eSIM) subscription industry analysis, the market’s entire worth would rise to US$13,510 million

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Laird Connectivity acquires Boundary Devices to expand its system on module portfolio

Akron, United States – Laird Connectivity, a global provider in wireless modules, internal antennas, IoT devices, and custom wireless solutions, has announced that it has acquired California-based Boundary Devices, a provider in designing and manufacturing System-on-Modules (SOM) and Single Board Computers (SBC).

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NXP’s MCX N microcontrollers usher in new era of smart, efficient edge processing

NXP Semiconductors has announced the MCX N94x and MCX N54x, the families in the N series of the MCX microcontroller portfolio. Designed to simplify design for secure intelligent edge applications, including IoT and industrial applications, the MCX N features the instantiation of NXP’s proprietary neural processing unit (NPU) and an integrated EdgeLock secure subsystem. The MCX N

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NXP OrangeBox a single domain controller offers development and security to cars

Detroit, United States – NXP Semiconductors announced the OrangeBox automotive-grade development platform, which integrates a wide variety of NXP wireless technologies, from broadcast radio, Wi-Fi 6 and Bluetooth, to secure car access with ultra-wideband (UWB) and Bluetooth low energy (BLE), and 802.11p-based V2X. The OrangeBox is a single, security enhanced, modular development platform that provides

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NXP collaborates with Foxconn on next generation vehicle platforms

The Netherlands, 20 July 2022 – NXP Semiconductors has announced that it has signed a memorandum of understanding with Hon Hai Technology Group (“Foxconn”) to jointly develop platforms for a new generation of smart connected vehicles. Hon Hai (Foxconn), the electronics manufacturer and a technology solution provider, will leverage NXP’s portfolio of automotive technologies and

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Foundries.io and Arduino deliver secure, embedded Linux IoT and edge solutions for the enterprise

London, UK. 24 March 2022 – Foundries.io, the specialist in cloud native development and deployment solutions for secure IoT and Edge devices, announced its partnership with Arduino to deliver secure, embedded Linux IoT and Edge solutions for the enterprise with the Arduino Pro Portenta X8.

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Trustonic joins NXP partner program and announces the availability of Kinibi 510 TEE

Cambridge, United Kingdom. 11th January 2022 – Cybersecurity technology provider Trustonic, announces it has joined NXP Semiconductors‘ Partner Program to support NXP’s latest processors for vehicle networking, targeting next-generation vehicle architectures and service-oriented gateways.

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NXP and Ford collaborate to deliver next-generation connected car experiences

Eindhoven, Netherlands, 10 November 2021 – NXP Semiconductors announced a collaboration with the Ford Motor Company to deliver enhanced driver experiences, convenience and services across its global fleet of vehicles, including the 2021 Ford F-150 pickup, Mustang Mach-E and Bronco SUVs. Ford’s new fully networked vehicle architecture implements NXP’s vehicle networking processors and the i.MX

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Global smart ticketing industry is expected to reach US$17.2bn by 2027

The smart Ticketing Market is majorly driven by its significant adoption in several public transportation companies. For instance, in August 2021, the Conduent Transportation, a global business unit of Conduent Incorporated announced successful implementation and released a contactless payment system that allows direct purchase of tickets on trams managed by Tramvie Elettriche Bergamasche (TEB), a bus

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