Cadence Innovus Implementation System speeds development of new Realtek DTV SoC solution

Cadence Design Systems, Inc. announced that Realtek Semiconductor Corp. used the Cadence® Innovus™ Implementation System for its 28nm Digital TV (DTV) System-on-Chip (SoC) production tapeout and achieved an area improvement and reduced power.

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Tigo & Aeris collaborate to reduce cost of energy via IoT technology

Tigo, a provider of the smart modular Flex Module-Level Power Electronics (MLPE) platform, and Aeris, a technology provider in the Internet of Things (IoT), announced they are collaborating to help users of solar energy reduce their costs through IoT technologies.

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