Fibocom to unveil a series of Linux-based edge AI solutions for industrial apps at Embedded World 2024

Fibocom in collaboration with Qualcomm Technologies have announced the launch of their cutting-edge Linux-based edge AI solutions which integrates a series of Qualcomm Technologies-powered Fibocom smart modules.

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IBASE and Qualcomm to unveil edge AI solutions at Embedded World 2024

IBASE Technology will collaborate with Qualcomm Technologies to showcase next-generation edge AI solutions at the upcoming Embedded World 2024. The event will take placed on April 9-11, 2024, IBASE will be stationed at booth 3-351 in hall 3.

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Thundercomm debuts AI video conferencing solutions for premium collaboration

Thundercomm has introduced its new set of AI video conferencing solutions at CES 2024. The launch aims to improve the experience and efficiency of business communication and collaboration.

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Sasken Technologies joins Qualcomm IoT Accelerator Program for IoT advancements

Sasken Technologies announced a collaboration with Qualcomm Technologies Inc. through the Qualcomm IoT Accelerator Program. This move aims to bring a change in the Internet of Things (IoT) landscape.

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BMW Group selects Amazon Web Services for its automated driving platform

BMW Group has chosen Amazon Web Services (AWS) as cloud provider for its automated driving platform. BMW Group will develop its future advanced driver assistance system (ADAS) using AWS to help create new features for its vehicles, “Neue Klasse,” which is set to introduce in 2025. The recent cloud-based system will leverage BMW’s pre existing

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Beacon EmbeddedWorks to develop embedded technologies based on Qualcomm solutions

Beacon EmbeddedWorks, a discoverIE Group company and global provider of embedded electronics, has joined the Qualcomm IoT Accelerator Programme from Qualcomm Technologies, Inc., enabling Beacon Embedded Works to design and manufacture advanced embedded electronics. This collaboration builds on Beacon EmbeddedWorks’ momentum in the embedded industry and investments that continue to push technology boundaries to serve its

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Semiconductor companies join forces to accelerate RISC-V

Semiconductor companies Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor, NXP Semiconductors, and Qualcomm Technologies, Inc., have come together to jointly invest in a company. This aims at advancing adoption of RISC-V (reduced instruction set computer-five) globally by enabling hardware development.

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Fibocom meets the media at MWC Barcelona 2023

Fibocom and Qualcomm used MWC Barcelona 2023 to launch the Fx180 & Fx190 Series modules, based on Qualcomm’s Snapdragon X72/75 Modem RF system. Here, Robin Duke-Woolley, CEO of Beecham Research, discusses it with Dan Schieler, SVP of IoT Overseas Sales at Fibocom and CEO of Rolling Wireless. They also examine the unveiling with MediaTek of

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Qualcomm extends its’ offerings for IoT markets

With Qualcomm’s recent announcement of the innovative Qualcomm Aware Platform, which extends the company’s reach into providing connectivity for IoT devices, Transforma Insights’ Jim Morrish speaks with Qualcomm’s Sebastiano Di Filippo, Senior Director, Business Development, IoT about the company’s future in the IoT. The discussion covers Qualcomm’s role driving the Connected Edge, discussion of customer

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Qualcomm unveils IoT LTE modem featuring integrated terrestrial positioning support

Qualcomm Technologies, Inc. announced its Internet of Things (IoT) modem – Qualcomm QCX216 LTE IoT Modem – an all-encompassing solution that offers greater computing capabilities, connectivity, and location-based technologies to enable a new generation of fast, powerful, high-performing IoT solutions.

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HFCL launches open source Wi-Fi 7 access points at India Mobile Congress

New Delhi, India – HFCL Limited, the high-tech enterprise and integrated communication product and solution provider in collaboration with Qualcomm Technologies, Inc. launches open source Wi-Fi 7 access points under its IO product line at India Mobile Congress, pragati maidan, New Delhi on 01 October 2022.

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GlobalFoundries and Qualcomm announce extension of long-term agreement to secure U.S. supply through 2028

Washington, United States. 08 August, 2022 – Following the recent passage of the U.S. Chips and Science Act last week, GlobalFoundries, a global provider in feature-rich semiconductor manufacturing and Qualcomm Technologies, Inc. announced they are more than doubling their existing strategic global long-term semiconductor manufacturing agreement previously entered into by GF’s and Qualcomm’s respective subsidiaries. The announcement secures wafer supply

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Fibocom debuts AI Smart Module SCA825-W, offering potential of AIoT

Shenzhen, China. 20 July, 2022 – Fibocom, a global provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announced the launch of AI smart module SCA825-W. Powered by Qualcomm Technologies‘ premium-tier SoC (System-on-Chip) QCS8250, the module is designed to meet the requirements of high-end AIoT scenarios such as HD video conferences, HD livestreaming, cloud gaming,

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Qualcomm debuts Snapdragon W5+ and W5 platforms for wearables

Qualcomm Technologies, Inc. has unveiled the latest additions to the company’s suite of premium wearable platforms, Snapdragon W5+ Gen 1 and Snapdragon W5 Gen 1. These platforms are designed to advance ultra-low power and breakthrough performance for connected wearables with a focus on extended battery life, premium user experiences, and sleek, innovative designs. By using

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Ericsson, Qualcomm and Thales to take 5G into space for satellite-driven non-terrestrial networks

Ericsson, Thales, a global specialist in aerospace, defence, security & digital identity, and wireless technology provider Qualcomm Technologies, Inc. are planning to take 5G out of this world and across a network of Earth-orbiting satellites.

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Qualcomm’s new wi-fi 7 and RF front-end modules are gunning for 5G auto and IoT device markets

London, UK. 27 June 2022 – Qualcomm Technologies, Inc. has launched new RF Front-End (RFFE) modules targeted for Wi-Fi and Bluetooth experiences. The expanded portfolio is designed for Bluetooth, Wi-Fi 6E, and the standard, Wi-Fi 7. The modules are designed for a wide array of device segments beyond smartphones including automotive, XR, PCs, wearables, mobile

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