IOT Solutions World Congress 2024 connects semiconductor chips to industry

Essential to manufacture computers, smartphones, cars, refrigerators or any electronic device, semiconductors are critical elements in the implementation of the Internet of Things. For this reason, IOT Solutions World Congress (IOTSWC), the leading international event on the transformation of industry through disruptive technologies, will give have a special focus this year on chip designers, manufacturers

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Thundercomm debuts AI video conferencing solutions for premium collaboration

Thundercomm has introduced its new set of AI video conferencing solutions at CES 2024. The launch aims to improve the experience and efficiency of business communication and collaboration.

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floLIVE, Qualcomm to enhance global connectivity on new Qualcomm Aware platform

floLIVE has announced that it is collaborating with Qualcomm Technologies, Inc. and its subsidiaries, one of the advanced wireless technologies providers. This will help to enhance global connectivity on the new Qualcomm Aware platform.

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Sonim enters next chapter of accelerated growth, expansion with new category of data devices

Sonim Technologies, Inc., has announced the expansion of its product portfolio to introduce a new category of 4G/5G wireless and Wi-Fi data devices. Sonim will offer a range of mobile hotspots, USB (universal serial bus) modems, and fixed wireless access (FWA) solutions under the category name Sonim Connect. The first of these products will be

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Qualcomm announces new Product Longevity Programme for industrial, enterprise IoT portfolio

Qualcomm Technologies, Inc. has announced a new Product Longevity Programme for a select catalogue of its IoT (internet of things) solutions. The programme will initially cover 16 different Qualcomm Technologies IoT system-on-chips (SOCs) to support longer and more durable life cycles for customer product designs.

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R&S, Qualcomm to test 3GPP Release 17 GSO, GEO satellite chipsets for IoT-NTN

Rohde & Schwarz in collaboration with Qualcomm Technologies, Inc., will conduct a set of tests for NB-IoT over non-terrestrial networks (NTN) to verify two-way internet of things (IoT) data across various operating modes using GSO (geosynchronous orbit) and GEO (geostationary orbit) constellations in line with the 3GPP Release 17. At the MWC Shanghai 2023, Rohde

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Qualcomm debuts IoT solutions to enable new industrial applications, help scale IoT ecosystem

Continuing its efforts to expand the Internet of Things (IoT) ecosystem and IoT use cases, Qualcomm Technologies, Inc. has announced new IoT solutions to enable the advancement of next-generation IoT devices: Qualcomm QCS8550, Qualcomm QCM8550, Qualcomm QCS4490 and Qualcomm QCM4490 processors.

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Smart labels will help IoT become ‘Massive’ with 581mn labels shipped in 2028, says ABI Research

Smart labels based on flexible printed electronic designs are starting to move beyond the design phase into large-scale commercial production, according to ABI Research, a global technology intelligence firm. As a new tool in the IoT toolbox, these devices promise a significant expansion in the use cases and corresponding value that can be generated initially in

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Thundercomm debuts SOMs TurboX C2210, C4210, C5430 to accelerate solutions in robotics, handheld devices

Thundercomm, an IoT product and solution provider announces release of new offerings in its smart IoT module portfolio to lower the barriers to enter the market and accelerate various AIoT industry segments, including robotics, handheld devices, tablets and smart cameras.

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Athonet, Crosscall, Qualcomm to accelerate digital transformation in public safety with B68 band

More and more governments in Europe are undergoing a digital transformation across their public safety agencies. Band 68 is a dedicated frequency that can be used to support emergency management and other public safety use cases with critical private mobile radio (PMR) communications.

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Lantronix expands Open-Q Family to use Qualcomm SoC devices with advanced heterogenous compute architectures

Lantronix Inc., a global provider of secure turnkey solutions for the Industrial Internet of Things (IoT) and the Intelligent IT market, has announced the expansion of its Open-Q family with its new entry-level Open-Q 2290CS and mid-tier Open-Q 4290CS System-in-Package (SIP) chipset modules as well as the companion Open-Q AL2 Development Kit. The two SIP modules are footprint compatible, allowing

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Cavli Wireless, Qualcomm partner to bring next generation C16QS CAT1.bis cellular IoT module

San Jose, United States – Cavli Wireless, a IoT ready cellular module manufacturers, and Qualcomm Technologies. Inc., a wireless technology provider, have announced a collaboration for LTE CAT1 technology.

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New ambient computing from Wiliot to enable the massive IoT

San Diego, 22 September 2022 – Wiliot, the Internet of Things provider whose IoT platform is enabling trillions of “things” to gain intelligence, will premier its breakthrough ambient computing technology the Wiliot IoT Pixel to the telecommunications industry at MWC 2022 from September 28 through September 30 at Wiliot Booth #W2.1138.

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Quectel supports India’s 5G roll-out with IoT modules, antennas and services

Greater Noida, India – Quectel has announced that, with the inauguration of the 5G roll-out in India set later this month, its technologies and services are ready to support the introduction of 5G devices to the Indian market. Initially, 13 cities will get 5G services including Ahmedabad, Bengaluru, Chandigarh, Chennai, Delhi, Gandhinagar, Gurugram, Hyderabad, Jamnagar,

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Quectel launches SC200E LTE smart module series to power high-demand AIoT applications

Munich, Germany. 16 August, 2022 – Quectel Wireless Solutions, a global Internet of Things (IoT) solutions provider, has launched its new generation of multi-mode LTE Cat 4 smart modules, the SC200E series. The SC200E series delivers superior performance in LTE connectivity, multimedia functions and support for long lifespan IoT deployments, making it ideal for both industrial and

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Stellantis and Qualcomm collaborate to power new vehicle platforms with snapdragon digital chassis solutions

London, UK. 14 April 2022 – Stellantis N.V. and Qualcomm Technologies, Inc., announced a multi-year technology collaboration to utilise the latest Snapdragon Digital Chassis advancements to deliver intelligent, customisable and immersive in-vehicle experiences to millions of vehicles across Stellantis’ 14 iconic automotive brands beginning in 2024. Leveraging the Snapdragon Cockpit Platforms and 5G capabilities for telematics systems, Stellantis will have the

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