RAM

WINSYSTEMS has debuted entry in its well-received computer-on-module product line: the COMeT6-1100 COM (computer-on-module) express type 6 compact CPU (central processing unit) module. Leveraging the 11th gen Intel Core i3/i5/i7 processors for industrial, IoT (internet of things) and embedded systems, this module offers up to four cores of high-performance processing in a low-power platform. And, with RAM (random access

Toshiba has added new products ‘M3H group (2)’ to the ‘M3H group’ of the 32-bit microcontroller product group TXZ+ Family Advanced Class equipped with Cortex-M3 using the 40nm process.

Everyone loves a scalable product. When you purchase a new laptop, car, or movie-streaming service, scalability might be one of your criteria. For example, does your new laptop have the memory and RAM to handle your future work-related requirements? Does your automobile have enough seats to hold your growing family and all of its trappings?

LTE for IoT chipmaker Sequans Communications S.A. has formalised an agreement with NTT DOCOMO, the Japan-based mobile operator, to accelerate the development of LTE-M devices and applications on DOCOMO’s network, using Sequans’ Monarch LTE Platform, the world’s most highly optimised LTE-M chip solution.

Renesas Electronics, a supplier of advanced semiconductor solutions, and SEGGER, a provider of software, hardware, and development tools for embedded systems, announced a collaboration that makes SEGGER’s powerful emWin GUI software package available for commercial use at no cost to customers

Renesas Electronics, a supplier of advanced semiconductor solutions, announced the expansion of its popular RX65N/RX651 Group of microcontroller (MCU) lineup that addresses advanced security needs for connected devices operating in industrial automation, building automation, and smart metering systems.

LTE chipmaker Sequans Communications S.A. introduced Monarch, the industry’s first LTE Cat M chip, compliant with the 3GPP Release 13 LTE Advanced Pro standard that defines new narrowband capabilities of LTE for machine-type-communications (LTE MTC).

MicroEJ will unveil the latest version of its MicroEJ Operating System (OS), at Embedded World in Nuremberg, Germany (February 23-24, 2016).

Lantronix, Inc. has announced the worldwide availability of its xPico® Wi-Fi Pi Plate expansion board – which enables the easy integration of the Lantronix xPico Wi-Fi device server with the popular Raspberry Pi single board computer.

Paderborn, Germany – A new over-the-air (OTA) test system from COMPRION is designed to simulate complex use cases so that communication errors in this set-up are detected before expensive service roll-outs occur.