Building a custom remote SIM provisioning infrastructure made easy – Full control over soldered eSIMs

At the MWC, the world’s largest gathering for the mobile industry held in Barcelona, 26 February – 1 March 2018, Comprion shows the newest products in the field of eSIM and Remote SIM Provisioning (RSP).

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Hyperconvergence and the Internet of Things: Part 1

Hyperconvergence is a relatively new marketing term, says Bob Emmerson. Unfortunately, it can come across as a hyped-up version of regular voice/data convergence, which became an overused term many moons ago. 

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ThyssenKrupp in-house developed toii IIoT platform connects machines of different makes and generations

A milestone for the digital transformation: thyssenkrupp connects the machinery of the materials division via a new digital platform. Thanks to toii all machines can communicate with each other. Due to predictive maintenance the platform is also supposed to forecast the necessity of machine services in the future.

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congatec announces ComX standardisation initiative at ESEC 2017 to boost design efficiency

congatec, a technology company for embedded computer modules, single board computers and embedded design and manufacturing services, has announced an extended standardisation initiative ComX that goes beyond the current specifications for computer-on-modules.

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