Infineon and Wolfspeed extend silicon carbide wafer supply agreement

Infineon Technologies and Wolfspeed have announced the expansion and extension of their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018. The extended partnership includes a multi-year capacity reservation agreement. It contributes to Infineon’s general supply chain stability and concerns the growing demand for silicon carbide semiconductor products for automotive, solar

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Infineon, Resonac expand their cooperation for delivery of silicon carbide (SiC) materials

Munich, Germany – Infineon Technologies AG is extending its cooperation with silicon carbide (SiC) suppliers. The German-based semiconductor manufacturer has signed a new multi-year-supply and cooperation agreement with Resonac Corporation, complementing and expanding the announcement of 2021.

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Infineon introduces XENSIV TLE4971 sensor family for automotive applications

Munich, Germany – Infineon Technologies AG announced the addition of the XENSIV TLE4971 family to its current sensor portfolio for automotive applications. The 3.3 V devices are the next generation of TLI4971 devices available in a TISON package with an integrated rail and available in four different pre-programmed current ranges: 25 A, 50 A, 75

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