STPay-Boost IC combines hardware secure element with proprietary NFC-boost technology for better contactless performance

STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, and Fidesmo, the contactless-services developer and Mastercard approved global vendor,

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AI chipsets, solving current and future industry problems

Semiconductors power the electronically pervasive modern world. Artificial Intelligence (AI) is destined to support a vast number of technologies ranging from self-driving vehicles to social media analytics. The combination of AI with semiconductors represents a logical next step for silicon providers to embed AI into virtually anything that requires a processor says the author Gerry

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Smart light bulb to combine Zigbee 3.0 / BLE 5.0 and green power efficiency

Qorvo, a provider of RF solutions that connect the world, and Leedarson, a lighting and IoT solutions company, have partnered to create a family of smart home lighting products.

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More than one-third of companies employ managed security services to hunt cyber threats

Alert Logic, the provider of Security-as-a-Service solutions, announced data from Crowd Research Partners’ 2018 Threat Hunting Report that shows 84% of companies agree that threat hunting should be a top security initiative, yet 76% believe their Security Operations Centres (SOCs)

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‘Cost-efficient’ 3D surround view system for mass-produced vehicles launched by Renesas and Magna

Renesas Electronics Corporation, a supplier of automotive semiconductor solutions, and Magna, a mobility technology company and an automotive supplier, aim to accelerate the mass adoption of advanced driving assistance system (ADAS) features with a new cost-efficient 3D surround view system designed for entry- and mid-range vehicles.

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Cadence Innovus Implementation System speeds development of new Realtek DTV SoC solution

Cadence Design Systems, Inc. announced that Realtek Semiconductor Corp. used the Cadence® Innovus™ Implementation System for its 28nm Digital TV (DTV) System-on-Chip (SoC) production tapeout and achieved an area improvement and reduced power.

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Newly released mesh network performance results from Silicon Labs clarify IoT connectivity options

Silicon Labs has released the industry’s first comprehensive network performance results based on large-scale, multicast testing of Zigbee®, Thread and Bluetooth® mesh software. Each mesh networking protocol presents unique characteristics and advantages, depending on the use case and end application.

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AccelerComm and Achronix enable fast time to market with 5G polar code for Speedcore eFPGAs

Achronix Semiconductor Corporation, a provider in field programmable gate array (FPGA)-based hardware accelerator devices and embedded FPGA (eFPGA), announced its collaboration with AccelerComm Ltd, a semiconductor intellectual property (IP) company focusing on next-generation wireless communications acceleration.

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Renesas Electronics delivers R-Car V3H system-on-chip for automotive front cameras in Level 3 and Level 4 autonomous vehicles

With the rapid enhancement of advanced driving assistance systems (ADAS) and automated driving technologies, autonomous-driving vehicles are becoming a reality.

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Renesas Electronics and Green Hills Software collaborate on Connected Cockpit Vehicle

Renesas Electronics, a supplier of advanced semiconductor solutions, and Green Hills Software, the provider in high-assurance real-time operating systems and virtualisation, announced their collaboration for the Renesas Connected Cockpit Vehicle developed with a Dodge Ram truck.

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Qualcomm and Alibaba showcase the benefits of cloud-to-device integration to help drive the LTE IoT in China

Qualcomm Incorporated announced that its subsidiary, Qualcomm Technologies, Inc., and Alibaba have ported Alibaba Cloud Link One to run on the Qualcomm® MDM9206 global multi-mode LTE IoT modem.

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Renesas, Toyota, and Denso bring autonomous driving vehicles to market faster

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that its automotive technologies will drive Toyota Motor Corporation’s autonomous vehicles, which are presently under development and scheduled for commercial launch in 2020.

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Arrow Electronics, Synaptics and NXP team to accelerate the development of Amazon Alexa-enabled smart home products

Arrow Electronics, Synaptics Incorporated and NXP Semiconductors launched a variant of the Synaptics AudioSmart 2-Mic Development Kit for Amazon AVS that is supported by a commercially available NXP system-on-chip (SoC) application processor.

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Renesas Electronics and ASTC accelerate software development for smart cameras with virtual platform for R-Car V3M

Renesas Electronics, a supplier of advanced semiconductor solutions, Australian Semiconductor Technology Company Pty Ltd (ASTC), and VLAB Works, a subsidiary of ASTC, announced a joint development of the VLAB/IMP-TA Simulator virtual platform (VP) for Renesas’ R-Car V3M,

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PolarFire’s FPGA provides an integrated and secure environment for connected machines

An advanced embedded technology provider, Solid State Supplies Ltd. now stocks PolarFire FPGAs from Microsemi Corporation. PolarFire is claimed to be the industry’s lowest power cost-optimised FPGA that offers a significant reduction in power over equivalent SRAM FPGAs while addressing specific market needs.

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Huawei demonstrates world’s first 5G network slicing application for the smart grid

At the PT Expo China 2017, in Beijing, Huawei is exhibiting the world’s first 5G network slicing application for smart grids. The application is based on Huawei’s 5G Core solution Service-Oriented Core (SOC), part of Huawei’s E2E 5G solution.

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