STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, and Fidesmo, the contactless-services developer and Mastercard approved global vendor,
Sequans Communications S.A., a LTE chipmaker, and STMicroelectronics, a global semiconductor company serving customers across the spectrum of electronics applications, introduced CLOE, a new LTE-connected tracker platform based on the integration of Sequans and ST technologies.
SecureRF Corporation, a provider of quantum-resistant security tools for the Internet of Things (IoT), announced that it has joined the STMicroelectronics Partner Program. Cooperation between the two companies will enable customers developing IoT solutions, across a wide selection of applications and markets, to take advantage of ST products
Autotalks, a provider in V2X communication chipsets, is launching SECTON, the latest addition to its chipset portfolio.
As with the all the company’s V2X solutions, Autotalks’ new secure,
Leti, an institute of CEA Tech, is hosting a one-day conference covering “System Reliability & Security in a Connected World” in Lyon, France, on June 23.
The club of the most innovative wearables worldwide has been selected by the international jury of the WT | Wearable Technologies Innovation World Cup.
Foxboro, MA, USA & Bangalore, India. June 03, 2013 – Wipro Ltd., a global IT, consulting and outsourcing company, and Axeda Corporation, a cloud-based service and software provider for managing connected products and M2M applications, today announced that Wipro has made a US$5 million investment in Axeda. Meanwhile, ST-Ericsson is to sell its connectivity [GNSS] business.
Developers of high-end set-top boxes and video gateways can significantly reduce time to market for their new products offering rich multi-screen viewing experiences, by taking advantage of the Reference Design Kit (RDK) from Comcast, now pre-integrated with the Orly STiH416 system-on-chip
STMicroelectronics has announced availability of innovative software and associated microcontrollers that will allow simple, low-cost high-tech electronic equipment to become more compelling and easy to use
IBM (NYSE:IBM), STMicroelectronics (NYSE:STM) and Shaspa have announced a collaboration to use cloud and mobile computing to enable consumers to manage and interact with their homes’ functions and entertainment systems.
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