TEE

As the line between mobile devices and computers becomes increasingly blurred, security architectures from two previously separate worlds are also converging. GlobalPlatform’s secure components – the Secure Element (SE) and Trusted Execution Environment (TEE) – are becoming de facto in mobile devices and the Trusted Computing Group’s (TCG) Trusted Platform Module (TPM) is widely deployed across the computing ecosystem.

Redpine Signals, Inc. claim to launch the industry’s first family of MCUs designed specifically to meet the high MIPS, memory and security demands of IoT devices, while at the same time improving battery life compared to traditional ARM-Cortex-M4 MCUs.

A Memorandum of Understanding (MoU) has been agreed between industry associations GlobalPlatform and the IoT Connectivity Alliance (ICA). The two technical bodies will work to develop and promote a standardised approach to internet of things (IoT) security based on secure component technology. This will reduce the cost and streamline the development of large-scale consumer and industrial IoT deployments.

Trustonic has announced a collaboration with systems-on-chips (SoCs) provider MediaTek to provide the automotive industry with highly secure telematics and in-car entertainment systems for connected vehicles.

Connected devices or IoT seem to have become the de facto solution for any industry, today. An increase in connected devices leads to increase in the amount of data transferred, stored, computed, and consumed across networks and devices.

Today, the number of connected devices is set to overtake the world’s human population. This connected devices ecosystem is what we popularly call the Internet of Things or IoT.

Device and application security provider, Trustonic has announced two new partnerships with key players in the expanding Chinese smartphone, tablet and wearable markets.

GlobalPlatform, the association standardising the management of applications on secure chip technology, says it has ‘conservatively estimated’ that a total of 17.7 billion secure elements (SEs) based on GlobalPlatform specifications were deployed globally between 2010 and 2015.

Industry association GlobalPlatform has signed a formal Memorandum of Understanding with the Car Connectivity Consortium (CCC).

A Memorandum of Understanding (MoU) has been agreed between technical bodies GlobalPlatform and the FIDO® (Fast IDentity Online) Alliance. The two industry associations are working to ease FIDO authenticator development on GlobalPlatform-based secure component products.

Redwood City, CA, USA. June 11, 2015 – GlobalPlatform has published an upgrade to its Card Specification v2.2 to protect the data exchange between a secure element (SE) and a trusted execution environment (TEE) on a mobile device.

The richness of today’s connected devices such as smartphones, tablets, set-top boxes and televisions, is bringing new challenges to service providers wanting to protect their offering against hackers and malware attacks.

Advanced testing provider, FIME, has taken steps to streamline near field communication (NFC) enabled device testing with the addition of new test libraries to its Global TEE test tool. The new tool, now named ‘Global Device’, has been upgraded following GlobalPlatform’s advancement of its device compliance programme to better support the needs of the mobile

16 July 2014 – GlobalPlatform, the organisation which standardises the management of applications on secure chip technology, has launched a training programme focused exclusively on leveraging the trusted execution environment (TEE) to enable secure application development and deployment for connected devices.

Event date: September 30, 2014 Santa Clara, California   GlobalPlatform To Host Second Dedicated TEE Event Following the Success of 2013 Conference Association opens call for papers to solicit contributions to the agenda