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IoT Magazine (ISSN 2397-2793) explores the evolving opportunities and challenges facing product and service providers across the Internet of Things. Our exclusive interviews pass on the key lessons learned by industry leaders in next gen Machine-to-Machine (M2M) and Internet of Things (IoT) services. Talking Heads, interviews, IoT insight reports, IoT enterprise buyers guide, IoT platforms reviews, guide to future IoT connectivity. All this you can find in IoT Now Magazine.

Posts Tagged ‘Teppo Hemiä’

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May 9, 2018

Wirepas and Silicon Labs team to deliver multiprotocol mesh networking solutions for the IoT

Wirepas, a provider of mesh software solutions, and Silicon Labs announced they have joined forces to deliver a combined hardware and software solution that unleashes the potential of multiprotocol connectivity for mesh networks.

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September 19, 2016

Telit expands sensor-to-cloud solutions with Bluetooth 4.2 module

Telit, a global enabler of the Internet of Things (IoT), has announced the commercial availability of its BlueMod+S42 Bluetooth 4.2 module, and two variants of the popular SL869 single and multi-standard positioning module family, the SL869-V3 and the SL869-ADR.

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August 25, 2016

Wirepas and u-blox partner for scalable and easy-to-use industrial Internet of Things solutions

Wirepas and u-blox, a global provider in wireless and positioning modules and chips, have partnered to offer an advanced decentralised radio communications solution (comparable with advanced mesh technology) for demanding industrial Internet of Things (IoT) applications.

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IoT LIFE LESSONS.

 
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