Metalenz, Dilusense partner on facial recognition for payment kiosks, smart locks

Metalenz, a provider in metasurface optics, and Chinese 3D sensing system supplier Dilusense, announced that they have partnered to bring performance and small form factor of Metalenz meta-optics to the

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UMC introduces 28eHV+ platform for wireless, VR/AR, IoT display applications

United Microelectronics Corporation, a global semiconductor foundry, has unveiled its 28eHV+ platform, the enhancement to its 28nm embedded high voltage (eHV) technology. Delivering greater power efficiency and visual quality, 28eHV+

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UMC, Cadence use AMS IC design flow across 5G, IoT, displays, other emerging applications

San Jose, California, Taiwan – United Microelectronics Corporation, a global semiconductor foundry, and Cadence Design Systems, Inc. has announced that the Cadence analog/mixed-signal (AMS) IC design flow has been certified for

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