Platforms & Applications
Asahi Kasei Microdevices launches new DC-DC step-up converter for efficient energy harvesting applications
Asahi Kasei Microdevices (AKM) has launched a new DC-DC step-up converter with ultra-low power consumption that is able to boost low voltages, offering solutions for remote and battery-free operation as
Read moreKlika Tech debuts cloud solutions to drive digital transformation with AWS, 1NCE, DH electronics
Klika Tech, a US-headquartered global systems integrator and product development company will join AWS, 1NCE and DH electronics at EmbeddedWorld ’23 demonstrating cloud solutions that drive digital transformation and better
Read moreSkylo expands DT’s converged cellular, satellite connectivity to IoT applications
Skylo, a satellite network service provider, has announced its collaboration with Deutsche Telekom (“DT”), a telecommunications provider, to provide the satellite network for DT’s converged cellular and satellite connectivity offering for IoT
Read moreIntelsat expands global reach for Deutsche Telekom IoT
Intelsat, an operator of integrated satellite and terrestrial networks and provider of inflight connectivity, has announced that Deutsche Telekom IoT (DT IoT) intends to integrate Intelsat FlexEnterprise into its cloud-based
Read moreInternational Women’s Day: Equity and equality in tech
March 8th marks International Women’s Day, a time to celebrate women’s achievements and reflect on what can be done to embrace equity. This call to action is important for industries
Read moreONVU Technologies unveils direct camera-to-cloud connectivity of its 360 video platform
ONVU Technologies, a global technology group focussed on smart video, IoT and cloud applications for the surveillance and education sectors, has announced the direct camera-to-cloud connectivity of its C-Series camera
Read moreSemtech, Broadcom demonstrate 200G/lane electrical-to-optical link at OFC 2023
Camarillo, United States – Semtech Corporation, a high-performance semiconductor, IoT systems and cloud connectivity service provider, has announced the demonstration of a 200G per lane (200G/lane) optical transmission link enabled
Read moreUMC introduces 28eHV+ platform for wireless, VR/AR, IoT display applications
United Microelectronics Corporation, a global semiconductor foundry, has unveiled its 28eHV+ platform, the enhancement to its 28nm embedded high voltage (eHV) technology. Delivering greater power efficiency and visual quality, 28eHV+
Read moreActility selects iBASIS, Sequans to deploy LTE-M solutions with eSIM, iSIM
Lexington, United States – iBASIS, a provider of communications solutions for operators and digital players worldwide, and Sequans Communications S.A., a developer and provider of 5G/4G chips and modules, have announced that Actility,
Read moreSilicon Labs, SparkFun Electronics reveal Thing Plus Matter board to support interoperability
Boulder, United States – SparkFun Electronics and Silicon Labs have announced the release of the Thing Plus Matter MGM240P Board – a development board that supports interoperability between different communication protocols and
Read moreSupermicro accelerates IT workloads with products featuring 4th Gen Intel Xeon scalable processors
Supermicro, Inc., a total IT solution provider for cloud, AI/ML, storage, and 5G/edge, will be showcasing its latest generation of systems that accelerate workloads for the entire telco industry, specifically
Read moreTata Communications, Oasis Smart SIM empowers SanCloud with scalable, secure CloudSIM
Tata Communications, a global digital ecosystem enabler and Oasis Smart SIM, a subsidiary of Tata Communications International Pte., Ltd., have announced that SanCloud will be powered by CloudSIM, a cloud-based embedded subscriber identity
Read moreNew i-ToF imager enables small 3D camera systems with improved quantum efficiency at optimised cost
Munich, Germany. 24 February 2023 – Infineon Technologies AG, in collaboration with 3D time-of-flight partner pmdtechnologies, has introduced the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of
Read moreQueclink launches two dual SIM LTE and Wi-Fi routers for fast, secure industrial connectivity
Queclink Wireless Solutions, a global manufacturer of Internet of Things (IoT) hardware, has announced launch of two LTE Cat 4 industrial routers with dual SIM cards. The WR201LEU is available
Read moreRadisys debuts programmable media analytics to monetise 5G, edge cloud applications
Radisys Corporation, a global provider of open telecom solutions, has announced the addition of Engage Media Analytics within the acclaimed Engage Digital Platform (EDP). Engage Media Analytics is a solution that provides communication
Read moreSEI Robotics selects Atmosic’s low power wireless, energy harvesting solutions for its portfolio of connected devices
Atmosic Technologies, a provider of energy harvesting platforms for the Internet of Things (IoT), has announced it is working with SEI Robotics, a global provider of development and manufacturing of Android
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