3D-IC
Samsung Foundry, Cadence collaborate to accelerate 3D-IC design development
Cadence Design Systems, Inc. has announced an expanded collaboration with Samsung Foundry. This collaboration will accelerate 3D-IC design development for applications like hyperscale computing, 5G, AI (artificial intelligence), IoT (Internet
Read more UMC, Cadence collaborate on 3D-IC hybrid bonding reference flow
United Microelectronics Corporation, a global semiconductor foundry, and Cadence Design Systems, Inc. has announced that Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for UMC’s chip stacking technologies,
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