InPlay launches small Bluetooth SoC in WLCSP package

Irvine, United States – InPlay Inc., a provider of advanced IoT solutions, has announced the release of its NanoBeacon SoC IN100 in a wafer level chip scale package (WLCSP). The

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Taoping boosts growth in large smart panel market, using its smart cloud, alliance networks

Hong Kong – Taoping Inc., announced that the company is accelerating its growth in the large smart panel market by leveraging active promotion from Taoping’s smart Cloud and alliance networks, combined

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