Infineon, UMC extend automotive partnership for 40nm eNVM microcontroller production

Infineon Technologies AG and United Microelectronics Corporation have announced a long-term cooperation agreement to multiply capacity for the production of Infineon automotive microcontroller in order to serve the expanding automotive

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UMC debuts new 28eHV+ platform for wireless, VR/AR, and IoT display applications

United Microelectronics Corporation, a global semiconductor foundry, has unveiled its 28eHV+ platform, the newest enhancement to its 28nm embedded high voltage (eHV) technology. Delivering greater power efficiency visual quality, 28eHV+

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UMC, Cadence collaborate on 3D-IC hybrid bonding reference flow

United Microelectronics Corporation, a global semiconductor foundry, and Cadence Design Systems, Inc. has announced that Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for UMC’s chip stacking technologies,

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