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Tachyum appoints Kiran Malwankar VP of system engineering
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Tachyum appoints Kiran Malwankar VP of system engineering

Posted by Anasia D'melloJuly 16, 2019

Tachyum Inc. announced it has appointed Kiran Malwankar to the position of vice president of System Engineering. Malwankar, a 30-year veteran of both pre-IPO companies and industry leaders, holds 21 U.S. patents in technologies such as I/O virtualisation, PCIe, storage virtualisation, and flash/solid-state media.

Malwankar joins the company after founding and/or joining a series of successful startups that delivered innovations in memory, AI, IoT, cloud, and flash devices; five of these companies were acquired and one went public. In addition, he has held executive and senior-level engineering positions at dominant vendors such as Cisco, Violin Memory, Nishan Systems/McDATA, and Aprius/FusionIO. He holds a master’s degree in electrical engineering from the prestigious Indian Institute of Technology in Mumbai.

“I am honored to oversee Tachyum’s breakthrough processor architecture and bring it to today’s most interesting applications and environments – supercomputing, hyperscalers, AI, deep machine learning, edge computing and IoT,” said Malwankar.

Among Malwankar’s professional achievements and patents are new high-speed bus protocols, circuit board design, FPGA design, processor-agnostic storage, and non-volatile memory. His engineering and design work is cross-functional, incorporating product management, marketing, and manufacturing, to deliver significant advancements in computing, not for their own sakes, but to meet market needs.

“Kiran has a rare combination of experience in complex compute, storage, and networking systems, plus the vision and strategy required to bring pioneering products to perfection,” said Dr. Radoslav “Rado” Danilak, Tachyum CEO. “With Kiran leading our system engineering team, Tachyum, a fabless semiconductor company, is now building a world-class organisation to deliver solutions, including reference designs, to our partners and customers next year, to accelerate widespread adoption of our chip products across multiple markets.”

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