Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, announced the 8Mb (Megabytes) 3V NOR W25Q80RV. The product has high read performance and smaller size, especially meeting the needs of edge devices in industrial and consumer application scenarios.
This 8Mb capacity serial flash is produced by Winbond Electronics’ own 12-inch wafer fab, and is manufactured using the 58nm technology. Compared with the previous generation products using 90nm, the size is reduced. The KGD (Known Good Die) and WLCSP (Wafer Level Chip Scale Package) versions of this product are ideal for a variety of small IoT devices.
“The Internet of Things is expanding to 50 billion connected devices by 2023,” says Alan Niebel, president of WebFeet Research, an independent market-research firm. “Winbond’s 3V 8Mb serial flash is suitable for both automotive and IoT segments. Overall, IoT is poised to grow in this new connected world with all shipments of serial flash totaling 12.9B units worldwide by 2027”.
The company has been supporting the requirements of customers using the 8Mb serial flash with the existing generation of W25QxxDV series for several years in applications including instrumentation, networking, PC, printer, automotive and gaming. Now the time has come to support these applications to include new use-cases such as wireless connectivity with KGD and WLCSP solutions in advanced technology and with smaller lead frame packages.
Winbond is a high-volume provider of KGD solutions for more than 10 years. KGDs are fully baked and tested to have the same reliability level as packaged products. They are ideal for stacking with MCUs or SoCs requiring high-speed flash access. With faster read speed to enhance system performance, faster programing for efficient manufacturing and firmware OTA (over-the-air) update coupled with the smaller form factor aspect of SIP (system-in-package), this new 8Mb flash provides greater value for a variety of embedded systems.
The W25Q80RV supports all single/dual/quad/QPI commands and read modes. It is ideal for executing code (XIP) directly from flash as well as code shadowing to RAM. This device operates on a single 2.7V to 3.6V power supply with power-down current down to 1μA. The flash is organised as small 4KB sectors which allow for greater flexibility and storage efficiency in applications that require code, data and parametre storage. SPI clock frequencies of up to 133MHz single data rate and 66MHz double data rate are supported. The read command bypass mode allows for faster memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing for true XIP (execute in place) operation.
“Winbond is proud and committed to innovate and differentiate by designing our serial flash KGD and WLCSP solutions for use in specialised applications requiring small-form-factor and non-volatile storage for MCUs and SoCs,” says Jackson Huang, flash product marketing vice president, Winbond. “We continue to work closely with customers and add value for their next-generation embedded solutions.”
W25Q80RV is available now. This will be followed by other densities in the family. For specific details, please visit Winbond.
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