European Utility Week, Amsterdam, The Netherlands, 16 October 2013 – Telit Wireless Solutions, a global provider of high-quality M2M solutions, products and services, has announced the market roll-out of the LE910 LTE module series with initial variants for North America and Europe.
The 3GPP Release 9 compliant products are positioned to expedite migration to 4G for new and existing designs including those already based on 2G or 3G members of the xE910 family. The new LTE modules deliver 100Mpbs download and 50Mbps upload speeds, making them ideal for applications in areas such as telematics for in-vehicle infotainment, video security and surveillance, outdoor signs and displays, business terminals and consumer products such as mobile hot-spots. The multi-band products are available in various combinations of number and frequency bands determined by region and operator requirements.
North American products will be available in operator-specific variants for AT&T and Verizon, each with band counts and frequencies addressing the needs of the individual carriers. The European variant will cover the region’s three most popular LTE bands, two HSPA+ bands and quad-band GSM/GPRS. .
The LE910 is a member of Telit’s flagship xE910 module family and its first series delivering 4G radio access technology in the 28.2 x 28.2 x 2.2 mm family form factor. The Telit xE910 Unified Form Factor Family is comprised of 2G, 3G, and 4G, 3GPP and 3GPP2 products sharing a common form factor as well as electrical and programming interfaces allowing developers to implement a “design once, use anywhere” strategy.
“The LE910 module series was designed to help early adopters of LTE get started with their designs leveraging a unique combination of features with LTE, GNSS and fallback technologies all packaged in the very compact form factor of the xE910 family,” said Felix Marchal, CPO at Telit Wireless Solutions. “The series will roll-out first in North America and Europe where integrators and mobile operators are keen on delivering the benefits of high-speed data to mobile platforms, particularly in Telematics and mobile broadband applications.”
Another exhibitor, STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed the industry’s first complete smart-meter System-on-Chip (SoC) that combines precision metering with flexible, programmable processing and PLC (Power-Line Communication) subsystems along with advanced security in a single device.
The STCOMET10 SoC delivers unprecedented integration, leveraging ST’s expertise in PLC and smart-meter ICs gained over 20 years and via more than 90 million devices delivered. OEMs can use this unique future-proof platform to simplify smart-meter design, reduce time-to-market, and significantly reduce component count and bill-of-materials costs.
ST has worked closely with utility companies and meter manufacturers to develop the STCOMET10 SoC, which already has a major role in the €27 million SOGRID project in France to develop a comprehensive communication system supporting smart-grid applications.
Leveraging a unique modular and integrated mixed-signal design, the STCOMET10 offers the highest system flexibility and programmability along with the highest performance for specialised smart-metering functions in a single chip.
“As an extremely cost-effective and flexible smart-meter solution, STCOMET10 has a key role in realising the advantages of the smart grid, including real-time control and adaptability of the grid, integration of decentralised generation from renewable energy sources, and support for multiple communication standards,” said Matteo Lo Presti, Group Vice President and General Manager, Industrial and Power Conversion Division, STMicroelectronics. “Globally there is scope for over 1.7 billion communicating devices connected to the smart grid. STCOMET10 greatly increases the prospects for interoperability among these devices promoting more efficient utilisation of energy resources.”
