ATP, the Flash storage and DRAM module manufacturer and an active member of the Intel IoT Solution Alliance, introduced its rugged storage products specifically targeting the IoT markets. The products include microSD/SD, CF/CFast, 2.5” SSD and other embedded flash modules.
These products and solutions are built using proven, reliable as well as scalable validation testing processes endorsed and recognised by the loT hardware platform/system manufacturers and vendors. ATP will showcase these solutions and its new SATA III products at the upcoming ESEC 2015 from May 13th to 15th at the Tokyo International Exhibition Center (Tokyo BigSight), Japan.
IoT connects vast networks of physical devices, captures data intelligently, and transmits “big data” seamlessly into “business insight”. This gives rise to a rich ecosystem of embedded hardware across industries, but brings along challenges and rigid requirements. ATP SD/microSD is adopted by Atmark Techno’ Armadillo-IoT (built-in Armadillo-410), the gateway with Linux OS. Application with frequent writing small log files (< 1 NAND flash page size) from sensor/recorders results in high writing amplification (WAI), which affects the endurance and lowers usable life. ATP’s Advanced Wear Leveling and block management algorithms optimise writing files to prevent both excessive wear to NAND flash and memory endurance reduction.
Meanwhile, ATP SMART Life Tool is integrated into hosts and checking of real time health conditions by monitoring “Spare Utilisation Rate”, an early warning mechanism to avoid wear out and spare block exhaustion before device end life. ATP’s SD/microSD comprises of compact footprint ruggedised System-In-Package (SIP) manufactured devices, which are IP67/IP57 standard compliant for water/dustproof test IEC/EN 60529 with a wide operating temperature range from -40°C to 85°C. They are 100% tested for quality and long-term reliability.
