Network & Infrastructure

With that, we come to the end of this riveting exploration into the evolution of the SIM card. From the format-one SIM cards that resembled credit cards, to the embedded

Fibocom has announced the collaboration with STMicroelectronics in launching the  smart home solution using the Matter-compatible technologies, STM32WB55 and FG370. It ensures the centralised control of smart home devices across

Fibocom launches a highly integrated multi-mode smart module SC208 with gigantic performance leaps in 4G category and a series of feature-packed multimedia experience improvements during MWC Barcelona 2024. Powered by

Fibocom unveils the industry’s first 5G smart module solution that is compatible with Android, Linux and Windows operating systems, propelling the resilience of SoC-based wireless solution in the high-end AIoT

Fibocom has unveiled a deployable and commercialised 5G RedCap module solution tailored for 5G IoT scenarios. This initiative has been launched in collaboration with key customers, including but not limited

Fibocom launches a new series of 5G RedCap module integrated with MediaTek’s T300 5G modem, which is the world’s first 6nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap.

Remote SIM Provisioning (RSP) stands as a transformative development in telecommunications, reshaping how devices connect to and interact with mobile networks. This technology builds upon the advancements of traditional SIM,

Fibocom has unveiled the 5G smart module solution that is compatible with Android, Linux and Windows operating systems, propelling the resilience of SoC-based wireless solution in the high-end AIoT market.

Integrated SIM (iSIM) technology emerges as the latest advancement in the realm of telecommunications, pushing the boundaries of integrated connectivity further than ever before. Building on the foundation laid by

Fibocom, a leading global provider of IoT (Internet of Things) wireless solutions and wireless communication modules, exhibited at Mobile World Congress Barcelona at Booth #5I33 in Hall 5 of Fira

Embedded universal integrated circuit card (eUICC) technology represents a significant leap forward in the evolution of SIM card capabilities, setting a new standard for flexibility, efficiency and global connectivity. As

pSemi Corporation has announced the PE44951, a low-power, two-way phase shifter with digitally controlled step attenuation (DSA) for applications within the 5.925 – 7.525 GHz range. pSemi will showcase its latest products

ZTE Corporation has recently announced its participation at the Mobile World Congress 2024 in Barcelona from February 26 to 29. Under the theme “Unfolding the Intelligent Future,” the company aims to

Globe has announced a partnership with GMS, an AI-driven communications solutions partner, to build the future of customer experience for enterprises in the Philippines. The move will use GMS’ AI

Iveda has introduced IvedaAI Sense, an AI-based sensor that can detect smoke and vapor particles and incidents of bullying. Integrated into the IvedaAI platform, IvedaAI Sense can be installed in

MATSUKO and Telefónica have announced the launch of a spatial computing experience of holographic meetings, developed in collaboration with NVIDIA, which will enable creators to connect and collaborate as holograms