ISIM

A new chip is claimed to offer multiple ultra-low power connectivity options and low-power processing on the edge for the rapidly expanding Internet of Things (IoT) market. “This is the game changer we’ve been waiting for,” says Nohik Semel, CEO at Sony Semiconductor Israel.

Embedded SIM (eSIM) has emerged as a means to free consumers and connected devices from the constraints of the traditional, plastic subscriber identification module (SIM) card by enabling an eSIM or an integrated SIM (iSIM) to be embedded into a device at the point of manufacture and shipped globally.

floLIVE, an Internet of Things (IoT) connectivity provider of advanced 5G network solutions and a full suite of cloud-based global connectivity services, has collaborated with Kigen a global specialist in eSIM and iSIM security, and cellular IoT chipset provider, Sony Semiconductor Israel (Sony).

Smart metering Internet of Things (IoT) applications have the potential to solve the efficiency, cost and time challenges of manual metre monitoring and reading. As utilities embrace the full potential of digitalisation and strive to become more sustainable, they will need secure, reliable, and uninterrupted IoT connectivity in addition to a seamless, automated way to

Gemalto announces a new collaboration that will see its advanced mobile connectivity solutions integrated with Qualcomm® Snapdragon™ mobile PC platform, a product by Qualcomm Technologies Inc., a subsidiary of Qualcomm Incorporated. This paves the way for iSIM commercialisation on a growing range of Always Connected PCs, laptops and tablets.

CALLUP, a provider of Value Added Services (VAS) and Mobile Device Management (MDM) solutions for the telecom industry, will introduce at the Mobile World Congress (MWC) a new secured version of its eSIM remote management system for IoT (IoT eSIM Engine), with two new key network elements: