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Telit expands Qualcomm-based portfolio with LTE Concept product, and builds Intel® collaboration
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Telit expands Qualcomm-based portfolio with LTE Concept product, and builds Intel® collaboration

Posted by Jeremy CowanFebruary 25, 2013

Mobile World Congress, Barcelona, Spain. February 25, 2013 – Telit Wireless Solutions today announced the expansion of its long-standing relationship with Qualcomm Technologies, Inc. At the same time it is expanding its mobile computing offerings with Intel®

The collaboration with Qualcomm is marked by the introduction of a 4G LTE product and the development of variants for the company’s top selling 3G modules in the xE910 product family.

The complete portfolio allows the global vendor of machine-to-machine (M2M) modules and value-added services, to offer form factor-compatible Qualcomm Technologies-based solutions for CDMA, UMTS and LTE radio technologies to address the communications needs of M2M and Internet of Everything (IoE) application developers.

The LE910, based on Qualcomm Technologies’ GobiTM MDM9215, will be Telit’s first LTE module delivered in the xE910 product family, and the company’s second LTE offering, following the LE920 LTE automotive-grade module announced last year, also based on the MDM9215.

In January 2013, Telit introduced two new xE910 modules—the HSDPA UE910 V2 based on Qualcomm Technologies’ QSC6270-Turbo chipset and HSPA+ HE910 V2 based on Qualcomm Technologies’ MDM6200 chipset—to address the growing demand for 3G solutions. Variants of both products with support for Oracle Java ME Embedded 3.2 are being planned. With the LE910, the xE910 product family is now poised to address not only the 2G to 3G migration, but also the growing set of opportunities and applications that require LTE.

The Qualcomm Technologies’ chipsets have enabled Telit to build the xE910 family to provide interchangeability between 3GPP2—CDMA (1xRTT, EV-DO) and 3GPP—UMTS (HSDPA, HSPA+) and LTE variants, making the adaptation of customer applications to regional technical requirements quick and easy while minimizing time to market and total cost of ownership.

Visitors to the Telit booth at Mobile World Congress (Hall 5, G70) can glean the breadth of the product portfolio at the ‘Qualcomm Technologies Corner’, including existing and prototype products and their respective chipsets. Included in the display will be the LE910 product concept and a number of commercially available and prototype modules for the automotive industry.

“The increased scope of our relationship with Qualcomm comes at an exciting time, when we are seeing strong demand from the M2M market for our products and solutions,” said Oozi Cats, CEO of Telit. “By expanding our portfolio with products such as the LE910 module we can address the 3G and 4G market which were previously beyond our reach.”

“We are pleased to work with Telit to bring 4G LTE to the CDMA, HSPA and HSPA+ platforms based on certain Qualcomm Technologies’ chipsets,” said Nakul Duggal, vice president of product management, new markets, Qualcomm Technologies, Inc. “Qualcomm Technologies has an extensive 3G and 4G LTE chipset portfolio, helping Telit deliver solutions in various product tiers to address the myriad of technical and regional needs of M2M and IoE developers.”

Telit has been a one-stop-shop for the M2M community for more than a decade, leveraging a broad portfolio of hardware in cellular, short range and positioning technologies, artfully complemented by services and connectivity from m2mAIR. By applying products and services in synergizing bundles, delivered with global support and logistics matching each individual need or want, Telit aims to help eliminate technical risk, shortening time to market to the Internet of Everything.

Telit to expand its mobile computing offerings through collaboration with Intel®

Telit has also used Mobile World Congress to announce the introduction of a family of new data cards in the new M.2, Next Generation Form Factor (NGFF). The data cards augment the company’s mobile computing product line currently comprised of mPCIe modules in HSPA+ and 1xEvDO cellular technologies. The new data cards are to be based on Intel’s designs for LTE/DC-HSPA+ and HSPA+. They target not only new always-connected consumer and leading edge adopter applications such as Ultrabook™, laptops, tablets, but also commercial and industrial devices, as the current favored mPCIe form factor gets gradually replaced by M.2.

Telit has since 2002, applied Intel chipsets in many of its M2M modules but starting in September 2012 the two companies agreed to design and market data card products, to keep pace with growing global demand for mobile broadband solutions. Telit’s new M.2 lineup will include LN930 and HN930 product families conceived to address both global, regional, and speed requirements from cutting edge LTE/DC-HSPA+ and HSPA+ applications in mobile computing and gadgets. The Intel-based LTE products are set to deliver speeds up to 100 Mbps down and 50 Mbps up; Dual Carrier HSPA+ 42 Mbps down and 11.5 Mbps up; and HSPA+ 21 Mbps down and 5.76 Mbps up.

The sub-compact and ultra slim 30x42mm M.2 data cards include global satellite (and assisted) positioning technology and certified drivers for Windows™7 & 8. They also feature the industry’s new Firmware Switching standard enabling the host Operating System and drivers to switch the card’s firmware to the latest and specific cellular network approved revision, thus overcoming a long-standing complexity hurdle in provisioning cellular connectivity devices in non-operator branded consumer products. The switching is triggered by the simple insertion of the consumer or operator supplied SIM card into the PC’s SIM card slot.

The new data cards interface to the host computer or gadget through a USB 3.0 connection supporting selective suspend (SS) and link power management (LPM). The SS feature allows the device driver to turn off (standby) the data card when it goes idle. When the card is again active or required, the system wakes it and resumes normal operation. Both SS and LPM are critical for latest generation battery powered consumer devices such as the Ultrabook™, conceived to ensure the user can reap several hours of use before a battery recharge is needed. The data cards employ these and other power-saving standards and policies to enhance the user experience of the host device.

Telit’s industrialisation plans call for start of samples programme in Q2 and commercial availability in Q3 2013. To accelerate time to market for the PC OEMS, Intel has validated M.2 cards for use with the Intel Tablet and Ultrabook™ reference designs.

”Intel is pleased to be working with Telit to bring to market highly competitive modules offering worldwide coverage, high performance, and an optimised user experience,” said Horst Pratsch, head of Product Line Modules & M2M at Intel Corporation. “Telit 3G and 4G M.2 modules take advantage of Intel’s experience in ramping cellular technology globally in industry leading smartphone devices, along with integration, validation, and optimisation in Intel computing platforms.”

“Until recently, a large cellular infrastructure equipment vendor held a 50% market share in the data card market used in mobile computing, primarily with the mPCIe format. However, this supplier has exited the market representing a potentially disruptive development in the supply chain,” said Oozi Cats, Telit’s CEO. “Telit is perfectly positioned to step in to fill the gap given the high confidence level we enjoy with our customers, particularly OEMs with respect to long-term, high-volume supply as well as our strong global and local support structure.”

Ten years on, leveraging the industry’s broadest portfolio of hardware in cellular, short range and positioning technologies, is complemented by services and connectivity from m2mAIR. By applying products and services in bundles, delivered with global support and logistics matching each individual need or want, Telit intends to eliminate technical risk, thereby shortening time-to-market (TTM) to the Internet of Things, whichever industry or segment you come from.

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Jeremy Cowan

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