WINSYSTEMS has debuted entry in its well-received computer-on-module product line: the COMeT6-1100 COM (computer-on-module) express type 6 compact CPU (central processing unit) module. Leveraging the 11th gen Intel Core i3/i5/i7 processors for industrial, IoT (internet of things) and embedded systems, this module offers up to four cores of high-performance processing in a low-power platform. And, with RAM (random access memory) soldered down, it ably handles applications running in environments subject to shock, vibration and extended temperatures.
“We have seen strong acceptance of our Type 10 COM express modules in this accelerating market along with continuing concerns about data and device security and speed to market. These issues have only increased demand for highly reliable COM modules that are designed, manufactured and supported within the United States,” says WINSYSTEMS’ chief revenue officer Robert Dunaway. “We are driven to anticipate and fulfill customers’ needs for upgrade paths that maximise long-term availability and minimise supply chain risks.”
Elevated performance and security for critical applications
The COMeT6-1100’s performance optimally empowers embedded and real-time computing. It satisfies such critical applications as industrial automation and controls, robotics, and digital surveillance and signage. It is also ideal in myriad IoT devices for energy and transportation management, Mil/COTS (military / commercial off-the-shelf), scientific analysis and medical diagnostics. This compact module delivers up to 32GB LPDDR4 4226 MT/s of lightning-fast system memory. Hardware security is addressed through the module’s onboard discrete TPM (trusted platform module) 2.0 device for root-of-trust authentication.
The COMeT6-1100 module is designed for performance and availability within rugged industrial IoT environments. It remains in operating temperatures spanning -40C° to +85°C and is CE compliant. Onboard eMMC 5.x storage options extend from 8GB to 128GB, while the module’s soldered-down LPDDR4 (low-power double data rate4) RAM protects shock- and vibration-sensitive applications.
Functionality and flexibility abound
WINSYSTEMS has incorporated capability and expansion possibilities into its US designed and manufactured compact Type 6 footprint. The COMeT6-1100 module supports up to four independent video displays and expansion options: Three digital display Interfaces can be converted to DisplayPort++, HDMI (high definition multimedia interface) or DVI (digital visual interface) on the carrier, and one embedded DisplayPort (eDP) LCD (liquid crystal display) interface can be optionally with a single-channel LVDS (low-voltage differential signaling) output.
Connectivity is addressed through five configurable PCIe (peripheral component interconnect express) lanes, four USB (universal serial bus) 3.2 gen 1 and eight USB 2.0 channels along with one i226 2.5 Gb/s Ethernet RGMII (reduced gigabit media independent interface). HD (high definition) audio signals and two SATA (serial advanced technology attachment) 3.0 interfaces for storage are also available.
The USA-made COMeT6-1100 module is fully compatible with any carrier board conforming to the PICMG (PCI Industrial Computer Manufacturers Group) COM express type 6 standards. It is also ideally paired with WINSYSTEMS’ own newly launched COM express type 6 development carrier board, aiding in rapid prototyping and reducing time to market.
Recognised support and value
By developing and manufacturing its own computer-on-module products at its facility in Grand Prairie, Texas, WINSYSTEMS maintains control over all components and its recognised build quality. Its COM Express modules provide the functionality, performance and value required when developing products for diverse applications and extreme environments.
“Equally important at WINSYSTEMS, we back these rugged embedded solutions with top-notch technical support, BIOS (basic input output system) customisation services and timely delivery, so our customers get to market faster,” Dunaway notes. “Our application engineers are ready to address requests for information and provide design consultations to help customers take advantage of our expanding COM Express capabilities.”
US made and ready to ship
Orders for the new COMeT6-1100 module with 11th gen Intel Core i7 embedded processor (UP3-class) are being accepted now. Quantities up to 1,000 units per customer are available for delivery by Q4 2023, shipping from WINSYSTEMS’ Texas headquarters.
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