SoC

SecureRF and Intel Corporation are collaborating to provide engineers with quantum-resistant authentication and data protection solutions for Intel FPGA-based Internet of Things (IoT) projects. The first security toolkit, available now, addresses Intel’s DE10-Nano development board,

As part of Orange’s Essentials2020 strategy to diversify and succeed in the field of connected objects, Orange announces the launch of a new programme to ease and accelerate the adoption of cellular connectivity for object makers.

Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for Internet of Things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017 conference

Renesas Electronics, a premier supplier of advanced semiconductor solutions, announced that it has started volume shipment of its first R-Car system-on-chip (SoC) incorporating Automotive Grade Linux (AGL)-based software. AGL is a cross-industry effort to develop a fully open software stack for the connected car.

BlackBerry Ltd, is addressing safety and security, two of the most important factors for next-generation connected and autonomous vehicle software, with the launch of QNX® Hypervisor 2.0.

The Internet of Things (IoT) is connecting people and physical things to change the way business is done. There are a lot of aspects in IoT where innovation is happening from data processing to security to firmware to storage.

Over the coming months, Qualcomm Technologies will roll out changes and updates to our product brand positioning to best articulate the value of our technology and products for our customers and their end users.

Over the coming months Qualcomm is to roll out changes and updates to its product brand positioning to better articulate the value of Qualcomm’s products.

The REAL3™ image sensor chip from Infineon Technologies AG has been incorporated in the new Augmented Reality (AR) smartphone by ASUS.

The prpl Foundation and the IoT Security Foundation (IoTSF), two influential not-for-profit organisations working to promote security and openness in the Internet of Things (IoT), announced that they have entered into a formal agreement to cooperate on projects that put ‘security by design’ into the IoT.

At IoT Solutions World Congress, Think Silicon announced the NEMA |GFX API (Application Programming Interface) designed to accelerate high quality Graphics User Interface (GUI) development for embedded and wearable devices.

Dialog Semiconductor plc, a provider of highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth® low energy (LE) technology, has announced the launch of SmartBond™ DA14681, the world’s most integrated single-chip solution

Combined with Intel’s existing assets, Movidius Technology – for new devices like drones, robots, virtual reality (VR) headsets and more. Intel expects it to position the company to lead in providing computer vision and deep learning solutions from the device to the cloud.

Fujitsu Components has released the FWM7BLZ20-series Bluetooth 4.2 low energy module, which it describes as small, high quality, and powerful.

prpl Foundation, the open-source, community-driven, collaborative, non-profit foundation supporting the next gen connected devices industry, has announced the addition of four new members that will help steer the future of the Internet of Things (IoT).

Cesare Garlati, chief security strategist of prpl Foundation and co-founder and co-chair of the Mobile Working Group at Cloud Security Alliance, will give a keynote speech on putting security into the future of Internet of Things (IoT), cloud and mobile at the Cloud Security Summit in Milan on Wednesday May 18.